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Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
DOI: https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
DOI: https://doi.org/10.1115/1.4056559
Published Online: January 27, 2023
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Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys
Journal Articles

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

Tae-Yong Park, Hyun-Ung Oh
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011006.
Paper No: EP-20-1108
DOI: https://doi.org/10.1115/1.4050512
Published Online: August 6, 2021
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Topics: Fatigue life, Random vibration, Safety, Solder joints, Ball-Grid-Array packaging
Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
DOI: https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods

Muhammad Naqib Nashrudin, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031005.
Paper No: EP-20-1106
DOI: https://doi.org/10.1115/1.4049175
Published Online: January 19, 2021
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Topics: Flow (Dynamics), Pressure, Ball-Grid-Array packaging
Journal Articles

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Qiming Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021008.
Paper No: EP-19-1006
DOI: https://doi.org/10.1115/1.4046555
Published Online: March 18, 2020
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Topics: Ball-Grid-Array packaging, Epoxy resins, Failure, Fatigue, Finite element analysis, Printed circuit boards, Cycles, Fatigue failure
Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
DOI: https://doi.org/10.1115/1.4041064
Published Online: September 10, 2018
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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates
Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
DOI: https://doi.org/10.1115/1.4040923
Published Online: August 20, 2018
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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders
Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
DOI: https://doi.org/10.1115/1.4038028
Published Online: October 13, 2017
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Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)
Journal Articles

Analytical Solution for Electronic Assemblies Under Vibration

Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011003.
Paper No: EP-15-1113
DOI: https://doi.org/10.1115/1.4032497
Published Online: March 10, 2016
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Topics: Finite element analysis, Mode shapes, Solder joints, Solders, Stiffness, Stress, Vibration, Manufacturing, Deflection, Modal analysis
Journal Articles

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

Tzeng Yih-Fong, Chen Fu-Chen, Chen Chih-Huang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041004.
Paper No: EP-14-1080
DOI: https://doi.org/10.1115/1.4031471
Published Online: October 1, 2015
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Topics: Ball-Grid-Array packaging, Optimization, Principal component analysis, Shear strength, Wire, Wire bonding, Design, Performance evaluation, Process design
Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
DOI: https://doi.org/10.1115/1.4029441
Published Online: June 1, 2015
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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature
Journal Articles

Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

Benjamin Giron-Palomares, Xin Fu, Abel Hernandez-Guerrero, Bladimir Ramos-Alvarado
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031008.
Paper No: EP-13-1114
DOI: https://doi.org/10.1115/1.4027378
Published Online: May 12, 2014
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Topics: Inspection, Solders, Thermography, Temperature, Ball-Grid-Array packaging
Journal Articles

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

B. Fiedler, M. Fine, K. Kao, L. Keer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
DOI: https://doi.org/10.1115/1.4006708
Published Online: July 18, 2012
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Topics: Ball-Grid-Array packaging, Electrical resistance, Fracture (Materials), Shear (Mechanics), Stress, Cycles, Fatigue cracks, Failure, Fatigue, Shear stress
Journal Articles

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

P. Borgesen, D. Blass, M. Meilunas
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011010.
DOI: https://doi.org/10.1115/1.4005904
Published Online: March 19, 2012
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Topics: Ball-Grid-Array packaging, Bonding, Corners (Structural elements), Fracture (Materials), Solder joints, Solders, Cycles, Manufacturing, Cracking (Materials), Fracture (Process)
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
DOI: https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
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Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Simplified Thermal Model of a Stacked Ball Grid Array Package

Luigi P. M. Colombo, Alexey Petrushin, Davide Paleari
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021006.
DOI: https://doi.org/10.1115/1.4003991
Published Online: June 23, 2011
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Topics: Ball-Grid-Array packages, Solders, Temperature, Thermal resistance, Ball-Grid-Array packaging, Heat, Errors, Boundary-value problems, Junctions
Journal Articles

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
DOI: https://doi.org/10.1115/1.4003989
Published Online: June 23, 2011
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Topics: Alloys, Ball-Grid-Array packaging, Intermetallic compounds, Lead-free solders, Solder joints, Solders, Tin, Fracture (Materials), Finishes, Printed circuit board assemblies
Journal Articles

Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints

M. Meilunas, P. Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
DOI: https://doi.org/10.1115/1.4003863
Published Online: June 22, 2011
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Topics: Reliability, Solder joints, Solders, Temperature, Ball-Grid-Array packaging, Fatigue life, Manufacturing, Alloys
Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
DOI: https://doi.org/10.1115/1.4002741
Published Online: December 8, 2010
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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus