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Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

M. K. Md Arshad, I. Ahmad, A. Jalar, G. Omar, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
https://doi.org/10.1115/1.2229223
Published Online: November 29, 2005
View Article titled, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
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Topics: Adhesion, Aluminum, Atomic force microscopy, Nickel, Shear strength, Solders, Focused ion beams, Metallurgy, Scanning electron microscopy, X-rays
Journal Articles

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

D. Vogel, R. Ku¨hnert, M. Dost, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
https://doi.org/10.1115/1.1506698
Published Online: December 12, 2002
View Article titled, Determination of Packaging Material Properties Utilizing Image Correlation Techniques
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Topics: Atomic force microscopy, Deformation, Displacement, Displacement measurement, Flip-chip devices, Fracture (Materials), Materials properties, Packaging, Reliability, Stress
Journal Articles

Chemical-Mechanical Planarization of Low- k Polymers for Advanced IC Structures

Christopher L. Borst, Dipto G. Thakurta, William N. Gill, Ronald J. Gutmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 362–366.
https://doi.org/10.1115/1.1510138
Published Online: December 12, 2002
View Article titled, Chemical-Mechanical Planarization of Low- k Polymers for Advanced IC Structures
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Topics: Copper, Polymers, Semiconductor wafers, Slurries, Polishing, Atomic force microscopy, Polymer films, Phthalate plasticizers
Journal Articles

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

J. Zhang, C. Q. Cui, T. B. Lim, E. T. Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 291–296.
https://doi.org/10.1115/1.2793855
Published Online: December 1, 1999
View Article titled, Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
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Topics: Copper, Epoxy resins, Lamination, Printed circuit boards, Adhesion, Resins, Plasmas (Ionized gases), Atomic force microscopy, Polymerization, Temperature
Journal Articles

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
https://doi.org/10.1115/1.483128
Published Online: October 20, 1999
View Article titled, On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications
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Topics: Adhesion, Atomic force microscopy, Coatings, Polymers, Reliability, Thermal stability, Thin films, Fracture (Process), Fracture (Materials), Silicon