1-20 of 26
Anisotropy
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Electrically Conductive Adhesives in Microelectronics Packaging

Available to Purchase
Mukund Ayalasomayajula, Mohit Ravi Khurana, Prince Shiva Chaudhary
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041109.
Paper No: EP-23-1091
https://doi.org/10.1115/1.4065939
Published Online: August 9, 2024
View Articletitled, Electrically Conductive Adhesives in Microelectronics Packaging
Open the PDF for Electrically Conductive Adhesives in Microelectronics Packaging in another window
Topics: Adhesives, Fillers (Materials), Anisotropy, Particulate matter
Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Available to Purchase
Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041102.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: October 5, 2023
View Articletitled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
Open the PDF for Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals in another window
Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin
Journal Articles

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Available to Purchase
Soumya Bandyopadhyay, Justin A. Weibel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021009.
Paper No: EP-22-1047
https://doi.org/10.1115/1.4055987
Published Online: November 1, 2022
View Articletitled, A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
Open the PDF for A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers in another window
Topics: Heat, Transients (Dynamics), Temperature, Anisotropy
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Open Access
Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Articletitled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
Open the PDF for Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging in another window
Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy
Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Available to Purchase
Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
https://doi.org/10.1115/1.4039020
Published Online: March 2, 2018
View Articletitled, Thermal Metamaterials for Heat Flow Control in Electronics
Open the PDF for Thermal Metamaterials for Heat Flow Control in Electronics in another window
Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy
Journal Articles

Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect

Available to Purchase
X. C. Chen, Bo Tao, Z. P. Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031007.
https://doi.org/10.1115/1.4006889
Published Online: July 18, 2012
View Articletitled, Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect
Open the PDF for Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect in another window
Topics: Deformation, Finite element analysis, Particulate matter, Bonding, Adhesives, Anisotropy
Journal Articles

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

Available to Purchase
Yasutada Nakagawa, Ryohei Yokoyama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011005.
https://doi.org/10.1115/1.4005954
Published Online: March 19, 2012
View Articletitled, Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection
Open the PDF for Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection in another window
Topics: Hardening (Curing), Heating, Optimization, Temperature, Viscosity, Anisotropy
Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Available to Purchase
Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
https://doi.org/10.1115/1.4001229
Published Online: March 19, 2010
View Articletitled, High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
Open the PDF for High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer in another window
Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)
Journal Articles

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Available to Purchase
Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
https://doi.org/10.1115/1.3103947
Published Online: April 2, 2009
View Articletitled, High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules
Open the PDF for High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules in another window
Topics: Computational fluid dynamics, Junctions, Semiconductors (Materials), Temperature, Thermal conductivity, Modeling, Thermal analysis, Anisotropy
Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Available to Purchase
Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
View Articletitled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
Open the PDF for Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging in another window
Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

Available to Purchase
S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
View Articletitled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
Open the PDF for A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging in another window
Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields
Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

Available to Purchase
W. K. Chiang, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
https://doi.org/10.1115/1.1849236
Published Online: June 3, 2005
View Articletitled, Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing
Open the PDF for Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing in another window
Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Available to Purchase
Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
View Articletitled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
Open the PDF for Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation in another window
Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate

Available to Purchase
Liqiang Cao, Zonghe Lai, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
https://doi.org/10.1115/1.1846066
Published Online: March 21, 2005
View Articletitled, Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
Open the PDF for Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate in another window
Topics: Adhesion, Adhesives, Anisotropy, Testing, Fracture toughness, Reliability, Pressure
Journal Articles

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Available to Purchase
Rashed Adnan Islam, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
https://doi.org/10.1115/1.2056570
Published Online: February 14, 2005
View Articletitled, Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock
Open the PDF for Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock in another window
Topics: Anisotropy, Contact resistance, Shock (Mechanics), Particulate matter, Abrasion
Journal Articles

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

Available to Purchase
W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
https://doi.org/10.1115/1.1604153
Published Online: December 15, 2003
View Articletitled, Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
Open the PDF for Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound in another window
Topics: Anisotropy, Molding, Packaging, Stress, Temperature, Viscoelasticity, Finite element analysis
Journal Articles

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Available to Purchase
Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. Davies
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 76–83.
https://doi.org/10.1115/1.1533060
Published Online: March 14, 2003
View Articletitled, An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
Open the PDF for An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion in another window
Topics: Computer software, Flow (Dynamics), Forced convection, Heat transfer, Junctions, Modeling, Temperature, Thermal conductivity, Errors, Computational fluid dynamics
Journal Articles

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

Available to Purchase
D. Vogel, R. Ku¨hnert, M. Dost, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
https://doi.org/10.1115/1.1506698
Published Online: December 12, 2002
View Articletitled, Determination of Packaging Material Properties Utilizing Image Correlation Techniques
Open the PDF for Determination of Packaging Material Properties Utilizing Image Correlation Techniques in another window
Topics: Atomic force microscopy, Deformation, Displacement, Displacement measurement, Flip-chip devices, Fracture (Materials), Materials properties, Packaging, Reliability, Stress
Journal Articles

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Available to Purchase
Weidong Xie, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 61–66.
https://doi.org/10.1115/1.483133
Published Online: December 12, 1999
View Articletitled, Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures
Open the PDF for Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures in another window
Topics: Laminates, Stress, Thermal stresses, Shapes, Anisotropy, Electronic packaging
Journal Articles

Thermal Management in Direct Chip Attach Assemblies

Available to Purchase
D. F. Baldwin, J. T. Beerensson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 222–230.
https://doi.org/10.1115/1.2793844
Published Online: December 1, 1999
View Articletitled, Thermal Management in Direct Chip Attach Assemblies
Open the PDF for Thermal Management in Direct Chip Attach Assemblies in another window
Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions