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Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

J. Electron. Packag. March 2023, 145(1): 011109.

Paper No: EP-22-1035

DOI: https://doi.org/10.1115/1.4056477

Published Online: January 11, 2023

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Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver

Journal Articles

Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature

Abderrahmane Baïri, Bruno Chanetz, J. A. Millán-García

J. Electron. Packag. December 2017, 139(4): 041009.

Paper No: EP-16-1124

DOI: https://doi.org/10.1115/1.4038113

Published Online: October 25, 2017

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Topics: Adhesives, Junctions, Natural convection, Reliability, Temperature, Thermal conductivity, Packaging

Journal Articles

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

Rajiv L. Iyer, Daryl L. Santos

J. Electron. Packag. September 2017, 139(3): 031009.

Paper No: EP-17-1012

DOI: https://doi.org/10.1115/1.4037144

Published Online: July 14, 2017

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Topics: Adhesives, Drops, Nozzles, Pistons, Experimental design, Manufacturing, Experimental analysis, Fluids

Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar

J. Electron. Packag. June 2017, 139(2): 020902.

Paper No: EP-16-1149

DOI: https://doi.org/10.1115/1.4036356

Published Online: April 24, 2017

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Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives

Journal Articles

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Zhiyuan Zhu, Min Yu, Lisha Liu, Yufeng Jin

J. Electron. Packag. December 2015, 137(4): 044501.

Paper No: EP-15-1062

DOI: https://doi.org/10.1115/1.4031750

Published Online: October 20, 2015

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Topics: Adhesives, Bonding, Silicon, Temperature, Shear strength, Ultraviolet radiation

Journal Articles

Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect

X. C. Chen, Bo Tao, Z. P. Yin

J. Electron. Packag. September 2012, 134(3): 031007.

DOI: https://doi.org/10.1115/1.4006889

Published Online: July 18, 2012

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Topics: Deformation, Finite element analysis, Particulate matter, Bonding, Adhesives, Anisotropy

Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong

J. Electron. Packag. March 2010, 132(1): 011007.

DOI: https://doi.org/10.1115/1.4001229

Published Online: March 19, 2010

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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)

Journal Articles

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin

J. Electron. Packag. December 2009, 131(4): 041009.

DOI: https://doi.org/10.1115/1.4000363

Published Online: November 12, 2009

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Topics: Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat

Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber

J. Electron. Packag. June 2008, 130(2): 021006.

DOI: https://doi.org/10.1115/1.2912180

Published Online: May 8, 2008

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Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins

Journal Articles

Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

Cheng Lin, Fangang Tseng, Ching-Chang Chieng

J. Electron. Packag. June 2008, 130(2): 021005.

DOI: https://doi.org/10.1115/1.2912216

Published Online: April 25, 2008

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Topics: Lubricants, Self-assembly, Water, Solders, Adhesives, Manufacturing

Journal Articles

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Laura K. Frisk, Kati H. Kokko

J. Electron. Packag. September 2007, 129(3): 260–265.

DOI: https://doi.org/10.1115/1.2753909

Published Online: October 27, 2006

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Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Particulate matter, Pressure, Reliability, Temperature, Failure, Delamination

Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari

J. Electron. Packag. June 2007, 129(2): 149–156.

DOI: https://doi.org/10.1115/1.2721086

Published Online: August 14, 2006

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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields

Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann

J. Electron. Packag. June 2006, 128(2): 130–136.

DOI: https://doi.org/10.1115/1.2188952

Published Online: February 14, 2006

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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon

Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu

J. Electron. Packag. September 2006, 128(3): 177–183.

DOI: https://doi.org/10.1115/1.2227057

Published Online: August 7, 2005

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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip

Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan

J. Electron. Packag. June 2005, 127(2): 113–119.

DOI: https://doi.org/10.1115/1.1849236

Published Online: June 3, 2005

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Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing

Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME

J. Electron. Packag. June 2005, 127(2): 86–90.

DOI: https://doi.org/10.1115/1.1846062

Published Online: June 3, 2005

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Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation

Journal Articles

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Anand Desai, James Geer, Bahgat Sammakia

J. Electron. Packag. March 2006, 128(1): 10–17.

DOI: https://doi.org/10.1115/1.2159003

Published Online: May 18, 2005

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Topics: Boundary-value problems, Geometry, Heat, Heat conduction, Heat flux, Heat sinks, Integrated circuits, Temperature, Thermal conductivity, Thermal management

Journal Articles

Various Adhesives for Flip Chips

Z. W. Zhong

J. Electron. Packag. March 2005, 127(1): 29–32.

DOI: https://doi.org/10.1115/1.1846064

Published Online: March 21, 2005

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Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Reliability, Temperature, Epoxy adhesives, Epoxy resins, Manufacturing, Packaging

Journal Articles

Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

K. K. Lee, S. C. Tan, Y. C. Chan

J. Electron. Packag. March 2005, 127(1): 52–58.

DOI: https://doi.org/10.1115/1.1846068

Published Online: March 21, 2005

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Topics: Adhesives, Bonding, Hardening (Curing), Shear (Mechanics), Ultraviolet radiation, Fourier transform infrared spectroscopy

Journal Articles

Adhesive Joining Process and Joint Property With Low Melting Point Filler

Kiyokazu Yasuda, Jong-Min Kim, Kozo Fujimoto

J. Electron. Packag. March 2005, 127(1): 12–17.

DOI: https://doi.org/10.1115/1.1846060

Published Online: March 21, 2005

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Topics: Adhesives, Alloys, Fillers (Materials), Heat conduction, Melting point, Resins, Joining, Copper, Epoxy resins, Self-organization

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Journal citation

NARROW

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Various Adhesives for Flip Chips

Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

Adhesive Joining Process and Joint Property With Low Melting Point Filler

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