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1-20 of 19508
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
Published Online: January 27, 2023
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 1 Schematic of BGA test vehicle More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 2 Typical reflow profile for assembling BGA test vehicles More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 3 Micromechanical tester Instron 5948 and fixtures schematic More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 4 Schematic of the shear fatigue test More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 5 Typical hysteresis loop of SAC305 with OSP surface finish More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 6 Evolution of hysteresis loop for SAC305 with OSP surface finish at 20 MPa More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 7 Evolution of inelastic work per cycle for SAC305 with OSP surface finish at 20 MPa More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 8 Inelastic work to number of cycles of SAC305 OSP solder joints in stress-controlled test More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 9 Evolution of plastic strain per cycle for SAC305 with OSP surface finish at 20 MPa More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 10 Plastic strain to number of cycles of SAC305 OSP solder joints in stress-controlled test More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 11 The fatigue life of SAC305 OSP represented in Weibull plots in stress-controlled test More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 12 SAC305 OSP solder alloy life characteristics as a function of stress level More
Image
in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 13 Evolution of hysteresis loop for SAC305 with OSP surface finish at total strain 2.4% More
Image
in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 14 Variation of maximum load of hysteresis loop under various strain levels for SAC305 OSP More
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in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 15 Load drop parameter to number of cycles of SAC305 OSP solder joints More
Image
in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 16 Inelastic work to number of cycles of SAC305 solder joints in strain-controlled test More
Image
in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 17 Plastic strain range to number of cycles of SAC305 solder joints in strain-controlled test More
Image
in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 18 The fatigue life of SAC305 OSP represented in Weibull plots in strain-controlled test More
Image
in Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
> Journal of Electronic Packaging
Published Online: January 27, 2023
Fig. 19 SAC305 OSP solder alloy life characteristics as a function of strain level More
