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Journal Articles
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031004.
Paper No: EP-24-1023
Published Online: May 12, 2025
Image
Optical micrograph of Cu-B alloy: ( a ) 200X (inset presents Cu-B phase dia...
Available to Purchase
in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 1 Optical micrograph of Cu-B alloy: ( a ) 200X (inset presents Cu-B phase diagram) and ( b ) 1000X, respectively More about this image found in Optical micrograph of Cu-B alloy: ( a ) 200X (inset presents Cu-B phase dia...
Image
Microstructure of different boron decorated SAC157 solder before and after ...
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in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 2 Microstructure of different boron decorated SAC157 solder before and after high temperature storage; label on the images what the components are ( a ) boron free, ( b ) 0.015 wt %, ( c )0.02 wt %, and ( d ) 0.025 wt % More about this image found in Microstructure of different boron decorated SAC157 solder before and after ...
Image
Elementary mapping of SAC-15B including SEM, primary β-Sn, eutectic phase a...
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in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 3 Elementary mapping of SAC-15B including SEM, primary β-Sn, eutectic phase and well-distributed boron More about this image found in Elementary mapping of SAC-15B including SEM, primary β-Sn, eutectic phase a...
Image
Scanning electron microscopy microstructure variety by introducing differen...
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in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 4 Scanning electron microscopy microstructure variety by introducing different contents of boron particles: ( a )boron free, ( b )0.015 wt %, ( c ) 0.02 wt %, and ( d ) 0.025 wt %. ( a ) SAC157, ( b ) SAC-15B, ( c ) SAC-20B, and ( d ) SAC-25B. More about this image found in Scanning electron microscopy microstructure variety by introducing differen...
Image
Comparison of different concentration of boron decoration into SAC solder: ...
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in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 5 Comparison of different concentration of boron decoration into SAC solder: ( a ) Vickers microhardness of eutectic phase and ( b ) bulk hardness after thermal storage, respectively More about this image found in Comparison of different concentration of boron decoration into SAC solder: ...
Image
Intermetallic compound morphology in solder joint after HTS
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in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 6 Intermetallic compound morphology in solder joint after HTS More about this image found in Intermetallic compound morphology in solder joint after HTS
Image
Intermetallic compound thickness and roughness related to boron concentrati...
Available to Purchase
in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 7 Intermetallic compound thickness and roughness related to boron concentration and HTS conditions (150 °C at 100 h and 225 h) More about this image found in Intermetallic compound thickness and roughness related to boron concentrati...
Image
Determination of average grain size in boron decorated SAC samples by ASTM ...
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in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 8 Determination of average grain size in boron decorated SAC samples by ASTM E112 definition More about this image found in Determination of average grain size in boron decorated SAC samples by ASTM ...
Image
Shear strength curves for different solder samples
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in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 9 Shear strength curves for different solder samples More about this image found in Shear strength curves for different solder samples
Image
Morphology of fracture surface: ( a ) SAC157, ( b ) SAC-15B, ( c ) SAC-20B,...
Available to Purchase
in Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
> Journal of Electronic Packaging
Published Online: May 12, 2025
Fig. 10 Morphology of fracture surface: ( a ) SAC157, ( b ) SAC-15B, ( c ) SAC-20B, and ( d ) SAC-25B. In the inset, redand white dash lines denote as individual solder before shear fracture and after shear fracture, respectively. (Color version online). More about this image found in Morphology of fracture surface: ( a ) SAC157, ( b ) SAC-15B, ( c ) SAC-20B,...
Journal Articles
Optimization of the reliability of ball grid array solder joints under random vibration conditions using an improved BP neural network-based particle swarm algorithm
Available to Purchase
Accepted Manuscript
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1084
Published Online: April 17, 2025
Journal Articles
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031003.
Paper No: EP-24-1110
Published Online: April 7, 2025
Topics:
Flow (Dynamics),
Fluids,
Relaxation (Physics),
Simulation,
Temperature,
Vapors,
Heat,
Pressure,
Computational fluid dynamics,
Turbulence
Includes: Supplementary data
Image
Problem geometry
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in Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
> Journal of Electronic Packaging
Published Online: April 7, 2025
Fig. 1 Problem geometry More about this image found in Problem geometry
Image
Computational domain with the meshes used in mesh sensitivity study. Insets...
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in Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
> Journal of Electronic Packaging
Published Online: April 7, 2025
Fig. 2 Computational domain with the meshes used in mesh sensitivity study. Insets show the close-up view of the meshes from the coarsest (M0) to the finest (M4). Mid-cross sections at the lower and upper tubes show the lines where the flow rate is calculated for the liquid phase and two-phase mix... More about this image found in Computational domain with the meshes used in mesh sensitivity study. Insets...
Image
Sensitivity of evaporator temperature ( T MP 1 ) to...
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in Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
> Journal of Electronic Packaging
Published Online: April 7, 2025
Fig. 3 Sensitivity of evaporator temperature ( T MP 1 ) to the mesh More about this image found in Sensitivity of evaporator temperature ( T MP 1 ) to...
Image
Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), (...
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in Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
> Journal of Electronic Packaging
Published Online: April 7, 2025
Fig. 4 Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), ( b ) average fluid temperature ( T f av ), ( c ) peak pressure ( p max ), and ( d )mass flow rate ( m ˙ ) to the time-step selection, with the flow regime fixed at turbulent.... More about this image found in Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), (...
Image
Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), (...
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in Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
> Journal of Electronic Packaging
Published Online: April 7, 2025
Fig. 5 Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), ( b ) average fluid temperature ( T f av ), ( c ) peak pressure ( p max ), and ( d )mass flow rate ( m ˙ ) to the flow regime, with the time-step fixed at t s ... More about this image found in Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), (...
Image
Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), (...
Available to Purchase
in Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
> Journal of Electronic Packaging
Published Online: April 7, 2025
Fig. 6 Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), ( b ) average fluid temperature ( T f av ), ( c ) peak pressure ( p max ), and ( d )mass flow rate ( m ˙ ) to the selection of the ratio of the mass relaxation coefficients ( ... More about this image found in Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), (...
Image
Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), (...
Available to Purchase
in Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
> Journal of Electronic Packaging
Published Online: April 7, 2025
Fig. 7 Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), ( b ) average fluid temperature ( T f av ), ( c ) peak pressure ( p max ), and ( d ) mass flow rate ( m ˙ ) to the magnitude of the mass relaxation coefficients, while the rat... More about this image found in Sensitivity of ( a ) numerical fluid mass change ( Δ m f ), (...
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