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Issues

Volume 147, Issue 3
September 2025
In Progress
Journal of Electronic Packaging Cover Image for Volume 147, Issue 3
ISSN 1043-7398
EISSN 1528-9044
In this Issue

Research Papers

Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
Calvin Ling, Aizat Abas, Chew Cheng Kai, Muhammad Taufik Azahari
J. Electron. Packag. September 2025, 147(3): 031001. doi: https://doi.org/10.1115/1.4067897
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Topics: Convolutional neural networks , Image segmentation , Ball-Grid-Array packaging , Algorithms , Flip-chip devices , Flip-chip , Manufacturing
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
Muhammad Aqil Azman, Mohd Zulkifly Abdullah, Wei Keat Loh, Chun Keang Ooi
J. Electron. Packag. September 2025, 147(3): 031002. doi: https://doi.org/10.1115/1.4068143
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Topics: Computational fluid dynamics , Flow (Dynamics) , Simulation , Viscosity
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
Caner Ekin Kiper, Ignacio Gallego-Marcos, Stevin Van Wyk, Yigit Akkus
J. Electron. Packag. September 2025, 147(3): 031003. doi: https://doi.org/10.1115/1.4068209
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Supplementary data
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Topics: Flow (Dynamics) , Fluids , Relaxation (Physics) , Simulation , Temperature , Vapors , Heat , Pressure , Computational fluid dynamics , Turbulence

Technical Briefs

Submillimeter Reflector for Edge-Emitting Laser Package
Kuo-Tung Huang, Ying-Che Suang, Hsin-Lin Wu, Cheng-Han Wang, Qi-Hong Yang
J. Electron. Packag. September 2025, 147(3): 034501. doi: https://doi.org/10.1115/1.4068142
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Topics: Lasers
All Issues
Optimization of the reliability of ball grid array solder joints under random vibration conditions using an improved BP neural network-based particle swarm algorithm
J. Electron. Packag
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection
J. Electron. Packag
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
J. Electron. Packag (September 2025)
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
J. Electron. Packag (September 2025)
Submillimeter Reflector for Edge-Emitting Laser Package
J. Electron. Packag (September 2025)
  • Online ISSN 1528-9044
  • Print ISSN 1043-7398

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