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Issues
June 2016
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Article
Stretchable Thin Film Materials: Fabrication, Application, and Mechanics
J. Electron. Packag. June 2016, 138(2): 020801.
doi: https://doi.org/10.1115/1.4032984
Topics:
Buckling
,
Manufacturing
,
Thin films
,
Deformation
,
Plasma desorption mass spectrometry
,
Electronics
,
Design
Decomposable and Template Polymers: Fundamentals and Applications
J. Electron. Packag. June 2016, 138(2): 020802.
doi: https://doi.org/10.1115/1.4033000
Topics:
Polymers
,
Temperature
,
Ceilings
Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives
J. Electron. Packag. June 2016, 138(2): 020803.
doi: https://doi.org/10.1115/1.4033143
Topics:
Light-emitting diodes
,
Packaging
,
Polymers
Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
J. Electron. Packag. June 2016, 138(2): 020804.
doi: https://doi.org/10.1115/1.4033069
Topics:
Patents
,
Pressure
,
Sintering
,
Bonding
,
Semiconductors (Materials)
Research Papers
Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint
J. Electron. Packag. June 2016, 138(2): 021001.
doi: https://doi.org/10.1115/1.4032880
Topics:
Fatigue
,
Fracture (Materials)
,
Shear (Mechanics)
,
Shear stress
,
Temperature
,
Creep
,
Fracture (Process)
,
Fatigue life
,
Cycles
Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling
J. Electron. Packag. June 2016, 138(2): 021002.
doi: https://doi.org/10.1115/1.4032881
Topics:
Cycles
,
Solder joints
,
Fatigue life
,
Stress
Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging
J. Electron. Packag. June 2016, 138(2): 021003.
doi: https://doi.org/10.1115/1.4033165
Topics:
Coating processes
,
Computer simulation
,
Light-emitting diodes
,
Phosphors
,
Coatings
,
Packaging
,
Fluids
Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations
J. Electron. Packag. June 2016, 138(2): 021004.
doi: https://doi.org/10.1115/1.4033109
Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels
Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
J. Electron. Packag. June 2016, 138(2): 021005.
doi: https://doi.org/10.1115/1.4033309
Topics:
Coolants
,
Cooling
,
Flow (Dynamics)
,
Heat
,
Pressure drop
,
Temperature
,
Vehicles
,
Sensors
,
Silicon
Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis
J. Electron. Packag. June 2016, 138(2): 021006.
doi: https://doi.org/10.1115/1.4033106
Topics:
Bonding
,
Glass
,
Lasers
,
Temperature
,
Temperature distribution
,
Fittings
,
Sealing (Process)
Technical Brief
A Study on Electrical Reliability Criterion on Through Silicon Via Packaging
J. Electron. Packag. June 2016, 138(2): 024501.
doi: https://doi.org/10.1115/1.4032932
Topics:
Failure
,
Packaging
,
Reliability
,
Silicon
