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Issues
September 2008
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method
J. Electron. Packag. September 2008, 130(3): 031001.
doi: https://doi.org/10.1115/1.2957318
Topics:
Finite element methods
,
Heat conduction
,
Metals
,
Modeling
,
Simulation
,
Temperature
,
Chain
,
Finite element analysis
,
Thermal conductivity
,
Clocks
An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads
J. Electron. Packag. September 2008, 130(3): 031002.
doi: https://doi.org/10.1115/1.2957319
Thermal Design Methodology for an Embedded Power Electronic Module Using Double-Sided Microchannel Cooling
J. Electron. Packag. September 2008, 130(3): 031003.
doi: https://doi.org/10.1115/1.2957320
Topics:
Cooling
,
Design
,
Microchannels
,
Pressure drop
,
Heat sinks
,
Heat
,
Flow (Dynamics)
,
Copper
,
Coolants
Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys
J. Electron. Packag. September 2008, 130(3): 031004.
doi: https://doi.org/10.1115/1.2957321
A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels
J. Electron. Packag. September 2008, 130(3): 031006.
doi: https://doi.org/10.1115/1.2957326
Topics:
Cylinders
,
Elastomers
,
High pressure (Physics)
,
Poisson ratio
,
Pressure
,
Casting
,
Pressure sensors
,
Deformation
,
Stress
Analysis of Solderless Press-Fit Interconnections During the Assembly Process
Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
J. Electron. Packag. September 2008, 130(3): 031007.
doi: https://doi.org/10.1115/1.2957330
Topics:
Finite element analysis
,
Manufacturing
,
Pins (Engineering)
,
Press fits
,
Stress
,
Friction
Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints
J. Electron. Packag. September 2008, 130(3): 031008.
doi: https://doi.org/10.1115/1.2957322
Topics:
Current density
,
Electrodiffusion
,
Finite element analysis
,
Lead-free solders
,
Solder joints
,
Solders
,
Tin
Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses
J. Electron. Packag. September 2008, 130(3): 031009.
doi: https://doi.org/10.1115/1.2957328
Topics:
Flip-chip
,
Flip-chip devices
,
Inspection
,
Lasers
,
Modal analysis
,
Solders
,
Ultrasound
,
Mode shapes
Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method
J. Electron. Packag. September 2008, 130(3): 031010.
doi: https://doi.org/10.1115/1.2965209
Topics:
Entropy
,
Flow (Dynamics)
,
Heat sinks
,
Optimization
,
Pressure drop
,
Heat transfer
,
Clearances (Engineering)
Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels
J. Electron. Packag. September 2008, 130(3): 031011.
doi: https://doi.org/10.1115/1.2912182
Topics:
Turbulence
,
Forced convection
,
Shear stress
Research Papers
Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages
J. Electron. Packag. September 2008, 130(3): 031005.
doi: https://doi.org/10.1115/1.2957324
Topics:
Fillers (Materials)
,
Stress
,
Particulate matter
,
Flip-chip packages
,
Flip-chip devices
A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing
J. Electron. Packag. September 2008, 130(3): 031012.
doi: https://doi.org/10.1115/1.2966437
Topics:
Convection
,
Cooling
,
Lasers
,
Nozzles
,
Radiation (Physics)
,
Temperature
,
Temperature control
,
Testing
,
Manifolds
,
Pressure
Technology Reviews
Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
J. Electron. Packag. September 2008, 130(3): 034001.
doi: https://doi.org/10.1115/1.2957459
Topics:
Design
,
Electronic packaging
,
Optimization
,
Optimization algorithms
Technical Briefs
A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet
J. Electron. Packag. September 2008, 130(3): 034501.
doi: https://doi.org/10.1115/1.2809447
Topics:
Heat sinks
,
Heat transfer
,
Pressure drop
,
Reynolds number
,
Thermal resistance
,
Fluids
,
Fins
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