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Issues
September 2007
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
J. Electron. Packag. September 2007, 129(3): 221–228.
doi: https://doi.org/10.1115/1.2753884
Topics:
Flow (Dynamics)
,
Flow separation
,
Flow visualization
,
Jets
,
Nozzles
,
Pressure
,
Fins
,
Temperature
,
Impingement cooling
,
Reynolds number
Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
J. Electron. Packag. September 2007, 129(3): 229–235.
doi: https://doi.org/10.1115/1.2753885
Topics:
Epoxy adhesives
,
Epoxy resins
,
Uncertainty
,
Viscoelasticity
,
Temperature
,
Modeling
,
Lasers
,
Displacement
Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors
J. Electron. Packag. September 2007, 129(3): 236–246.
doi: https://doi.org/10.1115/1.2721080
Topics:
Design
,
Engineering prototypes
,
Modeling
,
Optimization
,
Testing
,
Displacement
,
Manufacturing
,
Deflection
,
Wear
Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
J. Electron. Packag. September 2007, 129(3): 247–255.
doi: https://doi.org/10.1115/1.2753887
Topics:
Cooling
,
Heat flux
,
Heat sinks
,
Heat transfer
,
Pressure drop
,
Temperature
,
Thermal resistance
,
Turbulence
,
Wall thickness
,
Water
Flexible Profile Compact Thermal Models for Practical Geometries
J. Electron. Packag. September 2007, 129(3): 256–259.
doi: https://doi.org/10.1115/1.2753908
Topics:
Boundary-value problems
,
Errors
,
Heat
,
Heat flux
,
Heating
,
Temperature
,
Temperature gradient
,
Integrated circuit packaging
,
Multi-chip modules
,
Reliability
Effect of RCC on the Reliability of Adhesive Flip Chip Joints
J. Electron. Packag. September 2007, 129(3): 260–265.
doi: https://doi.org/10.1115/1.2753909
Topics:
Adhesives
,
Bonding
,
Flip-chip
,
Flip-chip devices
,
Particulate matter
,
Pressure
,
Reliability
,
Temperature
,
Failure
,
Delamination
Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
J. Electron. Packag. September 2007, 129(3): 266–272.
doi: https://doi.org/10.1115/1.2753910
Topics:
Damping
,
Deflection
,
Dynamics (Mechanics)
,
Springs
,
Viscoelasticity
,
Viscosity
,
Dynamic analysis
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
J. Electron. Packag. September 2007, 129(3): 273–277.
doi: https://doi.org/10.1115/1.2753911
Topics:
Ball-Grid-Array packaging
,
Creep
,
Damage
,
Durability
,
Finite element analysis
,
Modeling
,
Solders
,
Thermomechanics
,
Reliability
,
Solder joints
Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder
J. Electron. Packag. September 2007, 129(3): 278–286.
doi: https://doi.org/10.1115/1.2753917
Topics:
Constitutive equations
,
Hardening
,
Kinematics
,
Shear (Mechanics)
,
Solders
,
Stress
,
Deformation
On-Wafer Capacitors Under Mechanical Stress
J. Electron. Packag. September 2007, 129(3): 287–290.
doi: https://doi.org/10.1115/1.2753918
Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors
J. Electron. Packag. September 2007, 129(3): 291–299.
doi: https://doi.org/10.1115/1.2753919
Topics:
Flow (Dynamics)
,
Heat
,
Heat flux
,
Heat transfer
,
Refrigeration
,
Temperature
,
Pressure drop
,
Refrigerants
,
Microchannels
Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
J. Electron. Packag. September 2007, 129(3): 300–306.
doi: https://doi.org/10.1115/1.2753920
Topics:
Finite element analysis
,
Glass
,
Stress
,
Wire
,
Manufacturing
,
Bridges (Structures)
,
Cooling
,
Temperature
Simulations of Process-Induced Warpage During IC Encapsulation Process
J. Electron. Packag. September 2007, 129(3): 307–315.
doi: https://doi.org/10.1115/1.2753936
Topics:
Shrinkage (Materials)
,
Simulation
,
Warping
,
Temperature
Spray Cooling of IGBT Devices
Robert G. Mertens, Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, Benjamin A. Saarloos
J. Electron. Packag. September 2007, 129(3): 316–323.
doi: https://doi.org/10.1115/1.2753937
A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results
J. Electron. Packag. September 2007, 129(3): 324–327.
doi: https://doi.org/10.1115/1.2756852
Topics:
Computational fluid dynamics
,
Fins
,
Heat
Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS
J. Electron. Packag. September 2007, 129(3): 328–338.
doi: https://doi.org/10.1115/1.2753958
Topics:
Brightness (Photometry)
,
Design
,
Heat
,
Light-emitting diodes
,
Phosphors
,
Silicones
,
Temperature
,
Thermal management
,
Temperature distribution
,
Packaging
Numerical Optimization of the Thermoelectric Cooling Devices
J. Electron. Packag. September 2007, 129(3): 339–347.
doi: https://doi.org/10.1115/1.2753959
Topics:
Cooling
,
Optimization
,
Temperature
,
Thermoelectric coolers
,
Electric current
Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
J. Electron. Packag. September 2007, 129(3): 348–355.
doi: https://doi.org/10.1115/1.2753970
Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects
J. Electron. Packag. September 2007, 129(3): 356–365.
doi: https://doi.org/10.1115/1.2753981
Topics:
Cycles
,
Design
,
Electronic packaging
,
Failure
,
Plasticity
,
Shapes
,
Solders
Technical Brief
Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
J. Electron. Packag. September 2007, 129(3): 366–370.
doi: https://doi.org/10.1115/1.2753988
Topics:
Convection
,
Density
,
Energy dissipation
,
Flat heat pipes
,
Heat transfer
,
Temperature
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