Topics: Creep , Solder joints , Lead-free solders , Solders , Shear (Mechanics) , Corners (Structural elements) , Shear stress , Stress , Printed circuit board assemblies , Reliability

Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board

Xiaoling He, Robert E. Fulton, Fellow ASME Professor

J. Electron. Packag. June 2002, 124(2): 77–84. doi: https://doi.org/10.1115/1.1457454

Abstract

View articletitled, Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board

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Topics: Deflection , Laminates , Printed circuit boards , Stress , Nonlinear dynamics , Stress analysis (Engineering) , Deformation , Equations of motion , Resonance

A New Creep Constitutive Model for Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, W. Zhou, H. L. J. Pang, Q. J. Yang

J. Electron. Packag. June 2002, 124(2): 85–90. doi: https://doi.org/10.1115/1.1462624

Abstract

View articletitled, A New Creep Constitutive Model for Eutectic Solder Alloy

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Topics: Constitutive equations , Creep , Solders , Stress , Temperature

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Sung Yi, Guangxing Luo, Kerm Sin Chian

J. Electron. Packag. June 2002, 124(2): 91–96. doi: https://doi.org/10.1115/1.1451845

Abstract

View articletitled, A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

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Topics: Constitutive equations , Creep , Deformation , Dislocations , Grain boundaries , Grain size , Solders , Stress tensors , Temperature

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen

J. Electron. Packag. June 2002, 124(2): 97–105. doi: https://doi.org/10.1115/1.1459471

Abstract

View articletitled, Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

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Topics: Hardening (Curing) , Relaxation (Physics) , Shrinkage (Materials) , Stress , Modeling , Flip-chip devices , Polymers , Storage , Deformation

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Timothy Ferguson, Member ASME, Jianmin Qu, Fellow ASME

J. Electron. Packag. June 2002, 124(2): 106–110. doi: https://doi.org/10.1115/1.1414133

Abstract

View articletitled, Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

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Topics: Absorption , Adhesion , Fracture (Materials) , Fracture toughness , Solder masks , Delamination , Stress , Flow (Dynamics) , Fracture (Process)

Birefringence Reducing Precision Replication Process Assisted by Infrared Radiation

Kimitoshi Sato, Yasuo Kurosaki, Professor, Fellow ASME

J. Electron. Packag. June 2002, 124(2): 111–114. doi: https://doi.org/10.1115/1.1451846

Abstract

View articletitled, Birefringence Reducing Precision Replication Process Assisted by Infrared Radiation

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Topics: Double refraction , Infrared radiation , Irradiation (Radiation exposure) , Disks , Molding

In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

Ben-Je Lwo, Tung-Sheng Chen, Ching-Hsing Kao, Yu-Lin Lin

J. Electron. Packag. June 2002, 124(2): 115–121. doi: https://doi.org/10.1115/1.1452244

Abstract

View articletitled, In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

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Topics: Packaging , Sensors , Stress , Calibration , Temperature

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

E. H. Wong, R. Rajoo, S. W. Koh, T. B. Lim

J. Electron. Packag. June 2002, 124(2): 122–126. doi: https://doi.org/10.1115/1.1461367

Abstract

View articletitled, The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

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Topics: Flip-chip devices , Modeling , Packaging , Reflow soldering , Stress , Electronic packaging , Thermal stresses , Diffusion (Physics) , Wire , Failure

Papers on Reliability

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

Qizhou Yao, Jianmin Qu

J. Electron. Packag. June 2002, 124(2): 127–134. doi: https://doi.org/10.1115/1.1459470

Abstract

View articletitled, Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

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Topics: Adhesion , Electronic packaging , Failure , Fracture (Materials) , Metals , Polymers , Surface roughness , Interface roughness , Aluminum , Fracture mechanics