Topics: Capacitors , Epoxy adhesives , Epoxy resins , Manufacturing , Nanocomposites , Composite materials , Ceramics , Polymers , Fillers (Materials) , Particulate matter

Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers

Hisham E. Hegab, Assistant Professor,, Eric B. Zimmerman, Associate Professor,, Gene T. Colwell, Professor Emeritus,

J. Electron. Packag. March 2002, 124(1): 7–11. doi: https://doi.org/10.1115/1.1392320

Abstract

View articletitled, Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers

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Topics: Computer simulation , Heat , Heat exchangers , Heat pipes , Soil , Stress , Temperature , Thermal management , Cooling systems , Transients (Dynamics)

Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures

Nazri Kamsah, Todd S. Gross, Igor I. Tsukrov

J. Electron. Packag. March 2002, 124(1): 12–21. doi: https://doi.org/10.1115/1.1402629

Abstract

View articletitled, Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures

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Topics: Diffusion (Physics) , Finite element analysis , Polymers , Stress , Copper , Thermal stresses , Shear stress

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

Ben-Je Lwo, Ching-Hsing Kao, Tung-Sheng Chen, Yao-Shing Chen

J. Electron. Packag. March 2002, 124(1): 22–26. doi: https://doi.org/10.1115/1.1414134

Abstract

View articletitled, On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

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Topics: Calibration , Sensors , Stress , Temperature , Manufacturing , Microelectronic packaging

Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad

Yasuo Takahashi, Michinobu Inoue

J. Electron. Packag. March 2002, 124(1): 27–36. doi: https://doi.org/10.1115/1.1413765

Abstract

View articletitled, Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad

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Topics: Bonding , Deformation , Wire , Wire bonding , Stress

Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages

Wen-Hwa Chen, Professor, Kuo-Ning Chiang, Associate Professor, Shu-Ru Lin, Graduate Student

J. Electron. Packag. March 2002, 124(1): 37–44. doi: https://doi.org/10.1115/1.1401738

Abstract

View articletitled, Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages

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Topics: Solder joints , Solders , Surface mount devices

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

Chia-Yu Fu, David L. McDowell, I. Charles Ume

J. Electron. Packag. March 2002, 124(1): 45–53. doi: https://doi.org/10.1115/1.1401737

Abstract

View articletitled, Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

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Topics: Cooling , Corners (Structural elements) , Finite element analysis , Printed circuit boards , Stress , Stress analysis (Engineering) , Temperature , Transients (Dynamics) , Wave soldering , Copper

Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure

Samuel I-En Lin, Mem. ASME,

J. Electron. Packag. March 2002, 124(1): 54–59. doi: https://doi.org/10.1115/1.1414135

Abstract

View articletitled, Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure

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Topics: Diffraction gratings , Fiber Bragg gratings , Fibers , Packaging , Temperature , Wavelength , Optical fiber , Deformation

Papers on Reliability

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Cemal Basaran, Assoc. Prof., and Director,, Rumpa Chandaroy, Staff Consultant,

J. Electron. Packag. March 2002, 124(1): 60–66. doi: https://doi.org/10.1115/1.1400752

Abstract

View articletitled, Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

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Topics: Constitutive equations , Damage , Fatigue life , Solder joints , Stress , Thermomechanics , Vibration , Finite element analysis , Reliability , Thermal expansion