Topics: Computer simulation , Computers , Design , Electronics , Flat heat pipes , Heat , Polymer composites , Temperature , Thermal conductivity , Thermal management

A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia

J. Electron. Packag. June 2000, 122(2): 107–114. doi: https://doi.org/10.1115/1.483141

Abstract

View articletitled, A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

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Topics: Ball-Grid-Array packaging , Heat sinks , Heat transfer , Junctions , Modeling , Natural convection , Radiation (Physics) , Solders , Temperature , Thermal conductivity

Thermal Placement Design for MCM Applications

Yu-Jung Huang, Shen-Li Fu

J. Electron. Packag. June 2000, 122(2): 115–120. doi: https://doi.org/10.1115/1.483142

Abstract

View articletitled, Thermal Placement Design for MCM Applications

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Topics: Algorithms , Design , Energy dissipation , Finite element analysis , Multi-chip modules , Simulation results , Reliability , Heat , Thermal management , Temperature distribution

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

Manjula N. Variyam, Weidong Xie, Suresh K. Sitaraman

J. Electron. Packag. June 2000, 122(2): 121–127. doi: https://doi.org/10.1115/1.483143

Abstract

View articletitled, Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

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Topics: Stress , Thermal expansion , Deformation , Electronic packaging , Plane strain , Modeling

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

J. Electron. Packag. June 2000, 122(2): 128–131. doi: https://doi.org/10.1115/1.483144

Abstract

View articletitled, Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

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Topics: Contact resistance , Particulate matter , Silicones , Sodium , Thermal conductivity , Boron , Water , Copper , Fillers (Materials) , Solders

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

Wataru Nakayama, Masud Behnia, Hiroaki Mishima

J. Electron. Packag. June 2000, 122(2): 132–137. doi: https://doi.org/10.1115/1.483145

Abstract

View articletitled, Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

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Topics: Boiling , Coolants , Critical heat flux , Flow (Dynamics) , Forced convection , Heat transfer , Strips , Subcooling , Temperature , Nozzles

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang

J. Electron. Packag. June 2000, 122(2): 138–146. doi: https://doi.org/10.1115/1.483146

Abstract

View articletitled, Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

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Topics: Cavities , Flow (Dynamics) , Molding , Pressure , Simulation , Temperature , Transfer molding , Viscosity , Computer simulation , Computer software

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

Adam Kuhl, Jianmin Qu

J. Electron. Packag. June 2000, 122(2): 147–151. doi: https://doi.org/10.1115/1.483147

Abstract

View articletitled, A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

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Topics: Adhesives , Fracture (Materials) , Fracture mechanics , Fracture toughness , Stress , Finite element analysis , Testing

Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

Nestor V. Queipo, Guy F. Gil

J. Electron. Packag. June 2000, 122(2): 152–159. doi: https://doi.org/10.1115/1.483148

Abstract

View articletitled, Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

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Topics: Electrical wires , Electronic components , Failure , Genetic algorithms , Heat , Heat transfer , Optimization , Pareto optimization , Printed circuit boards , Design

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

S. Han, K. K. Wang

J. Electron. Packag. June 2000, 122(2): 160–167. doi: https://doi.org/10.1115/1.483149

Abstract

View articletitled, Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

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Topics: Cavities , Cross-flow , Flow (Dynamics) , Molding , Epoxy adhesives , Epoxy resins , Semiconductors (Materials)

A Novel High Performance Die Attach for Ceramic Packages

J. Z. Shi, X. M. Xie, F. Stubhan, J. Freytag

J. Electron. Packag. June 2000, 122(2): 168–171. doi: https://doi.org/10.1115/1.483150

Abstract

View articletitled, A Novel High Performance Die Attach for Ceramic Packages

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Topics: Bonding , Ceramics , Cycles , Shear strength , Solidification , Temperature

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li

J. Electron. Packag. June 2000, 122(2): 172–177. doi: https://doi.org/10.1115/1.483151

Abstract

View articletitled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

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Topics: Acoustics , Capacitors , Ceramics , Delamination , Nondestructive evaluation , Testing , Microscopy , Thermal shock , Reliability , Failure analysis

Book Review

Handbook of Electronic Package Design

Michael Pecht,, Editor, Anthony J. Rafanelli,, Reviewer

J. Electron. Packag. June 2000, 122(2): 178–179. doi: https://doi.org/10.1115/1.483153

Abstract

View articletitled, Handbook of Electronic Package Design

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Topics: Design , Electronic packages , Thermal management , Printed circuit boards , Packaging

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Technical Papers

Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment

Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Thermal Placement Design for MCM Applications

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

A Novel High Performance Die Attach for Ceramic Packages

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Book Review

Handbook of Electronic Package Design

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