Topics: Thermal management , Adhesives , Electronics , Anisotropy , Design , Energy dissipation , Flip-chip , Flip-chip assemblies , Flip-chip devices , Junctions

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

K. Darbha, J. H. Okura, A. Dasgupta

J. Electron. Packag. December 1999, 121(4): 231–236. doi: https://doi.org/10.1115/1.2793845

Abstract

View articletitled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

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Topics: Durability , Flip-chip devices , Solders , Thermomechanics , Flip-chip , Damage , Stress , Stress analysis (Engineering) , Finite element model , Modeling

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers

J. Electron. Packag. December 1999, 121(4): 237–241. doi: https://doi.org/10.1115/1.2793846

Abstract

View articletitled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

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Topics: Durability , Flip-chip , Flip-chip devices , Solders , Thermomechanics , Fatigue , Finite element model , Solder joints , Architecture , Cycles

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

J. Lau, T. Chen, S.-W. R. Lee

J. Electron. Packag. December 1999, 121(4): 242–248. doi: https://doi.org/10.1115/1.2793847

Abstract

View articletitled, Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

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Topics: Ball-Grid-Array packages , Cavities , Flat heat pipes , Ball-Grid-Array packaging , Cooling , Epoxy adhesives , Epoxy resins , Glass , Printed circuit boards , Solders

Alternative Curing Methods for FCOB Underfill

M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan

J. Electron. Packag. December 1999, 121(4): 249–254. doi: https://doi.org/10.1115/1.2793848

Abstract

View articletitled, Alternative Curing Methods for FCOB Underfill

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Topics: Hardening (Curing) , Condensation , Failure mechanisms , Heat transfer , Vapors , Delamination , Failure , Fatigue failure , Flip-chip , Heating

Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model

G. K. Morris, S. V. Garimella, J. A. Fitzgerald

J. Electron. Packag. December 1999, 121(4): 255–262. doi: https://doi.org/10.1115/1.2793849

Abstract

View articletitled, Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model

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Topics: Flow (Dynamics) , Stress , Nozzles , Reynolds number , Confined flow , Errors , Flow visualization , Outflow , Renormalization (Physics)

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Y. Polsky, I. C. Ume

J. Electron. Packag. December 1999, 121(4): 263–270. doi: https://doi.org/10.1115/1.2793850

Abstract

View articletitled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

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Topics: Circuits , Modeling , Printed circuit boards , Reflow soldering , Thermoelasticity , Warping , Copper , Elasticity , Lamination , Micromechanics (Engineering)

Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

W. Ren, Z. Qian, M. Lu, S. Liu, D. Shangguan

J. Electron. Packag. December 1999, 121(4): 271–274. doi: https://doi.org/10.1115/1.2793851

Abstract

View articletitled, Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

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Topics: Alloys , Lead-free solders , Strips , Fatigue , Computers , Creep , Electronic packaging , Solders , Testing , Thermomechanics

Determination of Fracture Toughness for Metal/Polymer Interfaces

V. Sundararaman, S. K. Sitaraman

J. Electron. Packag. December 1999, 121(4): 275–281. doi: https://doi.org/10.1115/1.2793852

Abstract

View articletitled, Determination of Fracture Toughness for Metal/Polymer Interfaces

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Topics: Fracture toughness , Metals , Polymers , Finite element analysis , Fracture (Materials) , Electronic packaging

Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages

T. Winkler, A. Schubert, E. Kaulfersch, B. Michel

J. Electron. Packag. December 1999, 121(4): 282–285. doi: https://doi.org/10.1115/1.2793853

Abstract

View articletitled, Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages

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Topics: Electromagnetic scattering , Thermomechanics , Finite element analysis , Uncertainty , Simulation , Chaos , Electronic packages , Materials properties , Modeling , Optimization

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts

J. Xie, M. Pecht, A. Dasgupta, J. A. Swift, S. J. Wallace

J. Electron. Packag. December 1999, 121(4): 286–290. doi: https://doi.org/10.1115/1.2793854

Abstract

View articletitled, A Statistical Mechanical Model of Electrical Carbon Fiber Contacts

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Topics: Carbon fibers , Contact resistance , Fibers , Geometry

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

J. Zhang, C. Q. Cui, T. B. Lim, E. T. Kang

J. Electron. Packag. December 1999, 121(4): 291–296. doi: https://doi.org/10.1115/1.2793855

Abstract

View articletitled, Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

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Topics: Copper , Epoxy resins , Lamination , Printed circuit boards , Adhesion , Resins , Plasmas (Ionized gases) , Atomic force microscopy , Polymerization , Temperature

Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly

J. Zhu

J. Electron. Packag. December 1999, 121(4): 297–302. doi: https://doi.org/10.1115/1.2793856

Abstract

View articletitled, Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly

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Topics: Ball-Grid-Array packaging , Manufacturing , Microscale devices , Solder joints , Creep , Design , Solders , Cycles , Modeling , Reliability

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

J. A. Swanson, S. M. Heinrich, P. S. Lee

J. Electron. Packag. December 1999, 121(4): 303–311. doi: https://doi.org/10.1115/1.2793857

Abstract

View articletitled, An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

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Topics: Solders , Shear (Mechanics) , Deflection , Stiffness , Stress , Deformation , Die cutting , Displacement , Fatigue life , Finite element model

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Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review

Technical Papers

Thermal Management in Direct Chip Attach Assemblies

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

Alternative Curing Methods for FCOB Underfill

Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

Determination of Fracture Toughness for Metal/Polymer Interfaces

Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

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