Topics: Acoustics , Computers , Cracking (Materials) , Equilibrium (Physics) , Fracture (Process) , Heat , Heating , High temperature , Lumber , Microscopy

Uniform Channel Micro Heat Exchangers

X. Yin, H. H. Bau

J. Electron. Packag. June 1997, 119(2): 89–94. doi: https://doi.org/10.1115/1.2792225

Abstract

View articletitled, Uniform Channel Micro Heat Exchangers

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Topics: Heat exchangers , Dimensions , Heat , Thermal resistance , Flow (Dynamics) , Nitrogen , Performance characterization , Semiconductor wafers , Temperature

Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

A. A. Watwe, A. Bar-Cohen, A. McNeil

J. Electron. Packag. June 1997, 119(2): 95–105. doi: https://doi.org/10.1115/1.2792226

Abstract

View articletitled, Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

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Topics: Pool boiling , Pressure , Subcooling , Critical heat flux , Boiling , Nucleate pool boiling

Optimal Three-Dimensional Placement of Heat Generating Electronic Components

M. I. Campbell, C. H. Amon, J. Cagan

J. Electron. Packag. June 1997, 119(2): 106–113. doi: https://doi.org/10.1115/1.2792210

Abstract

View articletitled, Optimal Three-Dimensional Placement of Heat Generating Electronic Components

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Topics: Electronic components , Heat , Algorithms , Simulated annealing , Computers , Heat transfer , Temperature

Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints

D. Yao, J. K. Shang

J. Electron. Packag. June 1997, 119(2): 114–118. doi: https://doi.org/10.1115/1.2792212

Abstract

View articletitled, Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints

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Topics: Fatigue cracks , Solder joints , Stress , Tin , Shear (Mechanics) , Solders

Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT

T. S. Lee, T. P. Choi, C. D. Yoo

J. Electron. Packag. June 1997, 119(2): 119–126. doi: https://doi.org/10.1115/1.2792214

Abstract

View articletitled, Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT

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Topics: Finite element analysis , Geometry , Modeling , Solder joints , Bricks , Electronic packaging , Equilibrium (Physics) , Shapes , Soldering , Surface mount packaging

Thermal Stresses in Layered Electronic Assemblies

Z. Q. Jiang, Y. Huang, A. Chandra

J. Electron. Packag. June 1997, 119(2): 127–132. doi: https://doi.org/10.1115/1.2792218

Abstract

View articletitled, Thermal Stresses in Layered Electronic Assemblies

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Topics: Thermal stresses , Adhesives , Design , Stress , Electronic packages , Electronics , Euler-Bernoulli beam theory , Failure , Finite element analysis , Finite element methods

Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

W. W. King, C. J. Aloisio, Jr.

J. Electron. Packag. June 1997, 119(2): 133–137. doi: https://doi.org/10.1115/1.2792219

Abstract

View articletitled, Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

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Topics: Coatings , Delamination , Optical fiber , Polymers , Thermomechanics , Tension , Fibers , Compressive stress , Composite materials , Hydrostatics

Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems

D. Agonafer, A. Vimba

J. Electron. Packag. June 1997, 119(2): 138–143. doi: https://doi.org/10.1115/1.2792220

Abstract

View articletitled, Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems

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Topics: Computational fluid dynamics , Computer cooling , Solid models , Computer-aided design , Boundary-value problems , Fluids , Geometry , Materials properties , Mesh generation , Turbulence