Two-layer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 × 2.45 mm footprint and a hot spot of 0.5 × 0.5 mm in its center was studied in this research. Two different cases were simulated in which heat fluxes of 1500 W cm−2 and 2000 W cm−2 were applied at the hot spot. Heat flux of 1000 W cm−2 was applied on the rest of the chip. Each microchannel layer had 20 channels with an aspect ratio of 4:1. Direction of the second microchannel layer was rotated 90 deg with respect to the first layer. Fully three-dimensional (3D) conjugate heat transfer analysis was performed to study the heat removal capacity of the proposed two-layer microchannel cooling design for high heat flux chips. In the next step, a linear stress analysis was performed to investigate the effects of thermal stresses applied to the microchannel cooling design due to variations of temperature field. Results showed that two-layer microchannel configuration was capable of removing heat from high heat flux chips with a hot spot.
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September 2015
Research-Article
Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots
Abas Abdoli,
Abas Abdoli
MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
e-mail: aabdo004@fiu.edu
Department of Mechanical and
Materials Engineering,
Florida International University
,Miami, FL 33174
e-mail: aabdo004@fiu.edu
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George S. Dulikravich,
George S. Dulikravich
MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
e-mail: dulikrav@fiu.edu
Department of Mechanical and
Materials Engineering,
Florida International University
,Miami, FL 33174
e-mail: dulikrav@fiu.edu
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Genesis Vasquez,
Genesis Vasquez
MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
e-mail: gvasq007@fiu.edu
Department of Mechanical and
Materials Engineering,
Florida International University
,Miami, FL 33174
e-mail: gvasq007@fiu.edu
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Siavash Rastkar
Siavash Rastkar
MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
e-mail: srast002@fiu.edu
Department of Mechanical and
Materials Engineering,
Florida International University
,Miami, FL 33174
e-mail: srast002@fiu.edu
Search for other works by this author on:
Abas Abdoli
MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
e-mail: aabdo004@fiu.edu
Department of Mechanical and
Materials Engineering,
Florida International University
,Miami, FL 33174
e-mail: aabdo004@fiu.edu
George S. Dulikravich
MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
e-mail: dulikrav@fiu.edu
Department of Mechanical and
Materials Engineering,
Florida International University
,Miami, FL 33174
e-mail: dulikrav@fiu.edu
Genesis Vasquez
MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
e-mail: gvasq007@fiu.edu
Department of Mechanical and
Materials Engineering,
Florida International University
,Miami, FL 33174
e-mail: gvasq007@fiu.edu
Siavash Rastkar
MAIDROC Laboratory,
Department of Mechanical and
Materials Engineering,
e-mail: srast002@fiu.edu
Department of Mechanical and
Materials Engineering,
Florida International University
,Miami, FL 33174
e-mail: srast002@fiu.edu
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 20, 2014; final manuscript received March 2, 2015; published online April 16, 2015. Assoc. Editor: Mehmet Arik.
J. Electron. Packag. Sep 2015, 137(3): 031003 (8 pages)
Published Online: September 1, 2015
Article history
Received:
June 20, 2014
Revision Received:
March 2, 2015
Online:
April 16, 2015
Citation
Abdoli, A., Dulikravich, G. S., Vasquez, G., and Rastkar, S. (September 1, 2015). "Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots." ASME. J. Electron. Packag. September 2015; 137(3): 031003. https://doi.org/10.1115/1.4030005
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