Compared to single-phase heat transfer, two-phase microchannel heat sinks utilize latent heat to reduce the needed flow rate and to maintain a rather uniform temperature close to the boiling temperature. The challenge in the application of cooling for electronic chips is the necessity of modeling a large number of microchannels using large number of meshes and extensive computation time. In the present study, a modified porous media method modeling of two-phase flow in microchannels is performed. Compared with conjugate method, which considers individual channels and walls, it saves computation effort and provides a more convenient means to perform optimization of channel geometry. The porous media simulation is applied to a real chip. The channels of high heat load will have higher qualities, larger flow resistances, and lower flow rates. At a constant available pressure drop over the channels, the low heat load channels show much higher mass flow rates than needed. To avoid this flow maldistribution, the channel widths on a chip are adjusted to ensure that the exit qualities and mass flow rate of channels are more uniform. As a result, the total flow rate on the chip is drastically reduced, and the temperature gradient is also minimized. However, it only gives a relatively small reduction on the maximum surface temperature of chip.
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June 2014
Research-Article
Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution
Jun Jie Liu,
Jun Jie Liu
1
China Petroleum & Chemical Co.
,Beijing
, China
1Corresponding authors.
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Hua Zhang,
Hua Zhang
1
Carnegie Mellon University
,Pittsburgh, PA 15213
1Corresponding authors.
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S. C. Yao,
S. C. Yao
Carnegie Mellon University
,Pittsburgh, PA 15213
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Yubai Li
Yubai Li
Department of Mechanical Engineering,
Pennsylvania State University
,State College, PA 16801
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Jun Jie Liu
China Petroleum & Chemical Co.
,Beijing
, China
Hua Zhang
Carnegie Mellon University
,Pittsburgh, PA 15213
S. C. Yao
Carnegie Mellon University
,Pittsburgh, PA 15213
Yubai Li
Department of Mechanical Engineering,
Pennsylvania State University
,State College, PA 16801
1Corresponding authors.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received November 16, 2013; final manuscript received April 8, 2014; published online April 29, 2014. Assoc. Editor: Gongnan Xie.
J. Electron. Packag. Jun 2014, 136(2): 021008 (9 pages)
Published Online: April 29, 2014
Article history
Received:
November 16, 2013
Revision Received:
April 8, 2014
Citation
Jie Liu, J., Zhang, H., Yao, S. C., and Li, Y. (April 29, 2014). "Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution." ASME. J. Electron. Packag. June 2014; 136(2): 021008. https://doi.org/10.1115/1.4027420
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