The mandated switch of the overwhelming part of microelectronics assembly to lead-free soldering has left the manufacturers of many high reliability products, which are still exempt from the requirement to change, with a choice between imperfect alternatives. One of these involves the inclusion of lead-free BGAs and CSPs in a eutectic SnPb solder paste based reflow process. In order to assess the consequences of this for reliability it is not enough to subject samples to common accelerated tests. Mixing of the alloys is almost certain to affect the acceleration factors so that comparisons of test results may not reflect relative performances under service conditions. This was illustrated with for a set of model BGA components with 20 mil (0.5 mm) diameter SAC305 solder balls, which were reflow soldered onto printed circuit boards using a eutectic SnPb solder paste and tested in thermal cycling together with controls soldered with a SAC305 paste. Mixed joints were found to outperform pure SAC305 in −40/125°C tests but not in 0/100°C, and general trends suggest that mixed joints may compare more poorly in service.
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June 2011
Research Papers
Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints
M. Meilunas,
M. Meilunas
Universal Instruments Corporation
, Conklin, New York 13904 e-mail:
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P. Borgesen
P. Borgesen
Department of Systems Science and Industrial Engineering,
Binghamton University
, P.O. Box 6000, Binghamton, New York 13902-6000 e-mail:
Search for other works by this author on:
M. Meilunas
Universal Instruments Corporation
, Conklin, New York 13904 e-mail:
P. Borgesen
Department of Systems Science and Industrial Engineering,
Binghamton University
, P.O. Box 6000, Binghamton, New York 13902-6000 e-mail: J. Electron. Packag. Jun 2011, 133(2): 021001 (5 pages)
Published Online: June 22, 2011
Article history
Received:
September 27, 2009
Revised:
February 3, 2011
Online:
June 22, 2011
Published:
June 22, 2011
Citation
Meilunas, M., and Borgesen, P. (June 22, 2011). "Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints." ASME. J. Electron. Packag. June 2011; 133(2): 021001. https://doi.org/10.1115/1.4003863
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