A three-dimensional numerical model is developed to simulate the mold filling behavior in the plastic encapsulation of microchips. The conventional Hele–Shaw approximation is inadequate to analyze a complex molding compound flow behavior with multiple microchips in a single cavity. The developed numerical algorithm is based on the finite difference method combined with the robustness of volume of fluid volume-tracking method to solve the two-phase flow field in complex mold and die geometries. Twelve dies are arranged in a matrix-array in a single mold cavity. Short-shot experimental data are used to validate the numerical results for the melt flow front at different flow times. Close agreement between the experimental data and the numerical results demonstrates the applicability of the present computational model for the simulation of practical epoxy molding compound encapsulation.
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March 2010
Technical Briefs
Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
M. K. Abdullah,
M. K. Abdullah
School of Mechanical Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
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M. Z. Abdullah,
M. Z. Abdullah
School of Mechanical Engineering,
e-mail: mezul@eng.usm.my
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
Search for other works by this author on:
M. A. Mujeebu,
M. A. Mujeebu
School of Mechanical Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
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Horizon Gitano,
Horizon Gitano
School of Mechanical Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
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Z. M. Ariff,
Z. M. Ariff
School of Material and Mineral Resources,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
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R. Razali,
R. Razali
School of Aerospace Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
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K. A. Ahmad
K. A. Ahmad
School of Aerospace Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
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M. K. Abdullah
School of Mechanical Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
M. Z. Abdullah
School of Mechanical Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysiae-mail: mezul@eng.usm.my
M. A. Mujeebu
School of Mechanical Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
Horizon Gitano
School of Mechanical Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
Z. M. Ariff
School of Material and Mineral Resources,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
R. Razali
School of Aerospace Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia
K. A. Ahmad
School of Aerospace Engineering,
Universiti Sains Malaysia
, Engineering Campus, Seri Ampangan, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, MalaysiaJ. Electron. Packag. Mar 2010, 132(1): 014502 (6 pages)
Published Online: March 4, 2010
Article history
Received:
August 12, 2007
Revised:
September 28, 2009
Online:
March 4, 2010
Published:
March 4, 2010
Citation
Abdullah, M. K., Abdullah, M. Z., Mujeebu, M. A., Gitano, H., Ariff, Z. M., Razali, R., and Ahmad, K. A. (March 4, 2010). "Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement." ASME. J. Electron. Packag. March 2010; 132(1): 014502. https://doi.org/10.1115/1.4000719
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