An analytical model of steady state heat conduction in multiple cylindrical domains is presented and discussed. The domains are axisymmetric, contiguous, and coaxial. Three domains are considered in the current study. The thermal conductivities, thicknesses, and radii of the domains may be different. The entire geometry composed of the three connected domains is considered as adiabatic on its lateral surfaces and is subjected to uniform convective cooling at one end. The other end of the geometry is subjected to a constant heat flux, while uniform heat generation is imposed in one of the domains. The analytical solution of the model is found and special cases of it are shown to be in agreement with known solutions for simpler geometries. One application of this model relates to the thermal management of computer chips that are attached to a heat sink or a heat spreader. The three layers could simulate the chip, the thermal adhesive and the heat sink. Another application is the simulation of a nanotube or nanocylinder connecting a region of the chip to a region of the heat sink. Many other potential applications may be simulated using the different possible configurations for the solution presented.
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March 2006
Research Papers
Models of Steady Heat Conduction in Multiple Cylindrical Domains
Anand Desai,
Anand Desai
Department of Mechanical Engineering,
State University of New York
, Binghamton, NewYork 13902
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James Geer,
James Geer
Professor Emeritus
Department of Mechanical Engineering,
State University of New York
, Binghamton, NewYork 13902
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Bahgat Sammakia
Bahgat Sammakia
Professor
Department of Mechanical Engineering,
State University of New York
, Binghamton, NewYork 13902
Search for other works by this author on:
Anand Desai
Department of Mechanical Engineering,
State University of New York
, Binghamton, NewYork 13902
James Geer
Professor Emeritus
Department of Mechanical Engineering,
State University of New York
, Binghamton, NewYork 13902
Bahgat Sammakia
Professor
Department of Mechanical Engineering,
State University of New York
, Binghamton, NewYork 13902J. Electron. Packag. Mar 2006, 128(1): 10-17 (8 pages)
Published Online: May 18, 2005
Article history
Received:
July 29, 2004
Revised:
May 18, 2005
Citation
Desai, A., Geer, J., and Sammakia, B. (May 18, 2005). "Models of Steady Heat Conduction in Multiple Cylindrical Domains." ASME. J. Electron. Packag. March 2006; 128(1): 10–17. https://doi.org/10.1115/1.2159003
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