A two-dimensional model has been developed for the interfacial thermal stresses in short and long trilayer assemblies under both plane stress and plane strain conditions. Interfacial stresses are approximated using a combination of exact elasticity solutions and elementary strength of materials theories. Governing differential equations are linearized through a finite difference discretization procedure. The conditions of zero shear stress at the free edges and self-equilibrated peel stresses are satisfied. The approach is mathematically straightforward, can be extended to include inelastic behavior, and can be adapted to problems involving external loads and a variety of geometries. The results have been compared to available data in the literature and finite element analysis.
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September 2005
Research Papers
Interfacial Thermal Stresses in Trilayer Assemblies
H. R. Ghorbani,
H. R. Ghorbani
Department of Mechanical and Industrial Engineering,
University of Toronto
, 5 King’s College Road, Toronto, Ontario, Canada M5S 3G8
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J. K. Spelt
J. K. Spelt
Department of Mechanical and Industrial Engineering,
University of Toronto
, 5 King’s College Road, Toronto, Ontario, Canada M5S 3G8
Search for other works by this author on:
H. R. Ghorbani
Department of Mechanical and Industrial Engineering,
University of Toronto
, 5 King’s College Road, Toronto, Ontario, Canada M5S 3G8
J. K. Spelt
Department of Mechanical and Industrial Engineering,
University of Toronto
, 5 King’s College Road, Toronto, Ontario, Canada M5S 3G8J. Electron. Packag. Sep 2005, 127(3): 314-323 (10 pages)
Published Online: November 24, 2004
Article history
Received:
April 15, 2004
Revised:
November 24, 2004
Citation
Ghorbani, H. R., and Spelt, J. K. (November 24, 2004). "Interfacial Thermal Stresses in Trilayer Assemblies." ASME. J. Electron. Packag. September 2005; 127(3): 314–323. https://doi.org/10.1115/1.1938205
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