A finite element method (FEM) formulation for the prediction of unknown steady boundary conditions in heat conduction for multidomain three-dimensional (3D) solid objects is presented. The FEM formulation is capable of determining temperatures and heat fluxes on the boundaries where such quantities are unknown, provided such quantities are sufficiently overspecified on other boundaries. An inverse finite element program has been previously developed and successfully tested on 3D simple geometries. The finite element code uses an efficient sparse matrix storage scheme that allows treatment of realistic 3D problems on personal computer. The finite element formulation also allows for very straightforward treatment of geometries composed of many different materials. The inverse FEM formulation was applied to the prediction of die-junction temperature distribution in a simple ball grid array electronic package. Examples are presented with simulated measurements, which include random measurement errors. Regularization was applied to control numerical error when large measurement errors were added to the overspecified boundary conditions.
Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components
Manuscript received April 26, 2004; revision received April 28, 2004. Review conducted by: B. Sammakia.
Dennis, B. H., Han, Z., and Dulikravich, G. S. (January 24, 2005). "Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components ." ASME. J. Electron. Packag. December 2004; 126(4): 457–464. https://doi.org/10.1115/1.1827261
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