Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water and N, N-dimethylformamide for helping the dissociation of the salt to release ions, gives thermal contact conductance that is almost as high as that given by Sn-Pb solder, similar to that given by boron nitride particle filled sodium silicate, and much higher than that given by boron nitride particle filled silicone.
Issue Section:Technical Papers
Keywords:filled polymers, particle reinforced composites, thermal resistance, packaging, cooling, Polymer, Polyethylene Glycol, Lithium, Boron Nitride, Thermal Interface, Thermal Contact, Thermal Conductance, Composite
Topics:Boron, Contact resistance, Lithium, Particulate matter, Ions, Sodium, Silicones, Solders, Thermal conductivity, Water
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