Skip Nav Destination
Just Accepted Manuscript
Research-Article April 17, 2025
Optimization of the reliability of ball grid array solder joints under random vibration conditions using an improved BP neural network-based particle swarm algorithm
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4068450
Email alerts
RSS Feeds
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
J. Electron. Packag (September 2025)
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
J. Electron. Packag (September 2025)
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
J. Electron. Packag (September 2025)
Submillimeter Reflector for Edge-Emitting Laser Package
J. Electron. Packag (September 2025)
