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Keywords: interconnect
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. July 2025, 92(7): 071005.
Paper No: JAM-25-1049
Published Online: April 10, 2025
...Xiaojie Ma Thermal loads during the production and service process of power semiconductor devices can induce significant stress on interconnects, potentially leading to the fracture and even the ultimate failure of the devices. Increasing the flexibility of interconnects can mitigate this issue...