Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to uniform film stress and system curvature states over the entire system of a single thin film on a substrate. By considering a circular multilayer thin film/substrate system subjected to nonuniform temperature distributions, we derive relations between the stresses in each film and temperature, and between the system curvatures and temperature. These relations featured a “local” part that involves a direct dependence of the stress or curvature components on the temperature at the same point, and a “nonlocal” part, which reflects the effect of temperature of other points on the location of scrutiny. We also derive relations between the film stresses in each film and the system curvatures, which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary nonuniformities. These relations also feature a “nonlocal” dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. The interfacial shear tractions between the films and between the film and substrate are proportional to the gradient of the first curvature invariant, and can also be inferred experimentally.
Skip Nav Destination
e-mail: y-huang@northwestern.edu
Article navigation
March 2008
Research Papers
Stresses in a Multilayer Thin Film/Substrate System Subjected to Nonuniform Temperature
X. Feng,
X. Feng
Department of Engineering Mechanics,
Tsinghua University
, Beijing, 100084, P.R. China
Search for other works by this author on:
Y. Huang,
Y. Huang
Department of Civil/Environmental Engineering and Department of Mechanical Engineering,
e-mail: y-huang@northwestern.edu
Northwestern University
, Evanston, IL 60208
Search for other works by this author on:
A. J. Rosakis
A. J. Rosakis
Graduate Aeronautical Laboratory,
California Institute of Technology
, Pasadena, CA 91125
Search for other works by this author on:
X. Feng
Department of Engineering Mechanics,
Tsinghua University
, Beijing, 100084, P.R. China
Y. Huang
Department of Civil/Environmental Engineering and Department of Mechanical Engineering,
Northwestern University
, Evanston, IL 60208e-mail: y-huang@northwestern.edu
A. J. Rosakis
Graduate Aeronautical Laboratory,
California Institute of Technology
, Pasadena, CA 91125J. Appl. Mech. Mar 2008, 75(2): 021022 (7 pages)
Published Online: February 27, 2008
Article history
Received:
April 27, 2007
Revised:
June 6, 2007
Published:
February 27, 2008
Citation
Feng, X., Huang, Y., and Rosakis, A. J. (February 27, 2008). "Stresses in a Multilayer Thin Film/Substrate System Subjected to Nonuniform Temperature." ASME. J. Appl. Mech. March 2008; 75(2): 021022. https://doi.org/10.1115/1.2755178
Download citation file:
Get Email Alerts
Related Articles
A Technique for Deducing In-Plane Modulus and Coefficient of Thermal
Expansion of a Supported Thin Film
J. Eng. Mater. Technol (April,2002)
Phonon Heat Conduction in Thin Films: Impacts of Thermal Boundary Resistance and Internal Heat Generation
J. Heat Transfer (April,2001)
Extension of
Stoney’s Formula to Arbitrary Temperature Distributions in Thin Film/Substrate
Systems
J. Appl. Mech (November,2007)
Extended Stoney’s Formula for a Film-Substrate Bilayer With the Effect of Interfacial Slip
J. Appl. Mech (January,2008)
Related Proceedings Papers
Related Chapters
Transient Temperature and Heat Flux Measurement Using Thin-Film Microsensors
Ultrasonic Welding of Lithium-Ion Batteries
Laser Induced Damage of a Thin Film With an Absorbing Inclusion: Thermal Considerations of Substrates and Absorption Profiles
Laser Induced Damage In Optical Materials: 1983
Hardness and Adhesion of Filmed Structures as Determined by the Scratch Technique
Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings