The thermal-mechanical properties of the materials currently used in packaging are being reexamined as the electronic packaging industry moves towards chip scale packages and wafer scale packages. The rate-dependent transition of elastic modulus and viscosity from thermal softening to thermal hardening with rising temperature, which does not involve any phase change, has been observed in certain elastomers. An explanation about this interesting phenomenon is given based on thermodynamic considerations. A theoretical analysis is performed to show the limitation of existing viscoelastic models in predicting the transition. It appears that macroscopic material properties should be reexamined based on the physics behind the interaction between ordinary elasticity and entropic elasticity.
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July 2003
Brief Notes
Rate-Dependent Transition From Thermal Softening to Hardening in Elastomers
Z. Chen, Mem. ASME,
Z. Chen, Mem. ASME
Department of Civil and Environmental Engineering, University of Missouri-Columbia, Columbia, MO 65211
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J. L. Atwood,
J. L. Atwood
Department of Chemistry, University of Missouri-Columbia, Columbia, MO 65211
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Y.-W. Mai, Fellow ASME
Y.-W. Mai, Fellow ASME
Center for Advanced Materials Technology (CAMT), School of Aerospace, Mechanical and Mechatronic Engineering J07, The University of Sydney, Sydney NSW 2006, Australia
Search for other works by this author on:
Z. Chen, Mem. ASME
Department of Civil and Environmental Engineering, University of Missouri-Columbia, Columbia, MO 65211
J. L. Atwood
Department of Chemistry, University of Missouri-Columbia, Columbia, MO 65211
Y.-W. Mai, Fellow ASME
Center for Advanced Materials Technology (CAMT), School of Aerospace, Mechanical and Mechatronic Engineering J07, The University of Sydney, Sydney NSW 2006, Australia
Contributed by the Applied Mechanics Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS for publication in the ASME JOURNAL OF APPLIED MECHANICS. Manuscript received by the ASME Applied Mechanics Division, April 23, 2002; final revision, November 10, 2002. Associate Editor: M.-J. Pindera.
J. Appl. Mech. Jul 2003, 70(4): 611-612 (2 pages)
Published Online: August 25, 2003
Article history
Received:
April 23, 2002
Revised:
November 10, 2002
Online:
August 25, 2003
Citation
Chen, Z., Atwood , J. L., and Mai , Y. (August 25, 2003). "Rate-Dependent Transition From Thermal Softening to Hardening in Elastomers ." ASME. J. Appl. Mech. July 2003; 70(4): 611–612. https://doi.org/10.1115/1.1571860
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