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Proceedings Papers

Thermal Behavior in a Multi-Layer Metal Thin-Film With Interfacial Contact Conductance by the Parabolic Two-Step Model

Tsung-Wen Tsai, Yung-Ming Lee
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 461-466, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52168
https://doi.org/10.1115/MNHT2008-52168
View Paper titled, Thermal Behavior in a Multi-Layer Metal Thin-Film With Interfacial Contact Conductance by the Parabolic Two-Step Model
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Topics: Electrical conductance, Metals, Thin films, Heat, Microscale devices, Approximation, Electrons, Failure, Heating, Laplace transforms
Proceedings Papers

Phonon Thermal Boundary Conductance in 1-D Chains: Comparison Between the Semiclassical and Nonequilibrium Green’s Function Formalisms

Patrick E. Hopkins, Pamela M. Norris, Mikiyas S. Tsegaye, Avik Ghosh
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 467-476, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52233
https://doi.org/10.1115/MNHT2008-52233
View Paper titled, Phonon Thermal Boundary Conductance in 1-D Chains: Comparison Between the Semiclassical and Nonequilibrium Green’s Function Formalisms
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Topics: Chain, Electrical conductance, Phonons, Energy transformation, Thermal equilibrium, Dimensions, Equilibrium (Physics), Nanoscale phenomena, Thermal conductivity, Transport theory
Proceedings Papers

Measurements of Thermal Conductivity of Thin Films by 3-Omega Method

Saburo Tanaka, Makoto Takiishi, Koji Miyazaki, Hiroshi Tsukamoto
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 477-483, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52260
https://doi.org/10.1115/MNHT2008-52260
View Paper titled, Measurements of Thermal Conductivity of Thin Films by 3-Omega Method
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Topics: Thermal conductivity, Thin films
Proceedings Papers

A Molecular Dynamics Study on Effects of Nanostructural Clearances at an Interface on Thermal Resistance

Masahiko Shibahara, Kosuke Inoue, Kiyomori Kobayashi
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 485-491, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52276
https://doi.org/10.1115/MNHT2008-52276
View Paper titled, A Molecular Dynamics Study on Effects of Nanostructural Clearances at an Interface on Thermal Resistance
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Topics: Molecular dynamics, Thermal resistance, Nanoscale phenomena, Temperature, Density, Temperature gradient, Atoms, Heat flux, Simulation
Proceedings Papers

Effects of High Current Density at Nanoscale Point Contacts

Hsinyi Lo, James A. Bain
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 493-502, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52349
https://doi.org/10.1115/MNHT2008-52349
View Paper titled, Effects of High Current Density at Nanoscale Point Contacts
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Topics: Atomic force microscopy, Current density, Electrodiffusion, Nanoscale phenomena, Probes, Melting, Coating processes, Coatings, Contact resistance, Damage
Proceedings Papers

The Influence of Molecular Orientation on the Ability of Water to Enter a Carbon Nanotube at Different Temperatures

James Cannon, Natalie Moore, Ortwin Hess
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 503-507, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52378
https://doi.org/10.1115/MNHT2008-52378
View Paper titled, The Influence of Molecular Orientation on the Ability of Water to Enter a Carbon Nanotube at Different Temperatures
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Topics: Carbon nanotubes, Temperature, Water, Flow (Dynamics), Nanotubes, Density, Density functional theory, Dynamics (Mechanics), Nanofluidics, Nanoscale phenomena
Proceedings Papers

Finite Element Modeling of Multi-Scale Thermal Contact Resistance

M. K. Thompson
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 509-517, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52385
https://doi.org/10.1115/MNHT2008-52385
View Paper titled, Finite Element Modeling of Multi-Scale Thermal Contact Resistance
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Topics: Contact resistance, Finite element analysis, Modeling, Surface roughness
Proceedings Papers

The Enhancement of Marangoni Condensation Heat Transfer by Addition of Additives

Baohong Peng, Li Yang
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 421-427, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52024
https://doi.org/10.1115/MNHT2008-52024
View Paper titled, The Enhancement of Marangoni Condensation Heat Transfer by Addition of Additives
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Topics: Condensation, Heat transfer
Proceedings Papers

Coupling Effect of Interfacial Transport on Particle-Surface Capillary Forces

Bo Gao, Xiaofeng Peng
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 429-434, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52033
https://doi.org/10.1115/MNHT2008-52033
View Paper titled, Coupling Effect of Interfacial Transport on Particle-Surface Capillary Forces
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Topics: Particulate matter, Adhesion, Bridges (Structures), Evaporation, Heat, Theoretical analysis
Proceedings Papers

Temperature Dependence of Thermal Conductivity for Silicon Dioxide

Da-Jeng Yao, Wei-Chih Lai, Heng-Chieh Chien
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 435-439, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52052
https://doi.org/10.1115/MNHT2008-52052
View Paper titled, Temperature Dependence of Thermal Conductivity for Silicon Dioxide
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Topics: Silicon, Temperature effects, Thermal conductivity
Proceedings Papers

Evaluation of Thermal Rectification at the Interface of Double-Layered Nanofilm by Molecular Dynamics Simulations

Juekuan Yang, Zhenghua Liu, Yujuan Wang, Yunfei Chen
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 441-444, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52092
https://doi.org/10.1115/MNHT2008-52092
View Paper titled, Evaluation of Thermal Rectification at the Interface of Double-Layered Nanofilm by Molecular Dynamics Simulations
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Topics: Interfacial thermal resistance, Molecular dynamics simulation, Thermal rectification
Proceedings Papers

Sessile Drop Evaporation on Surfaces of Various Wettability

Hyunsoo Song, Yongku Lee, Songwan Jin, Ho-Young Kim, Jung Yul Yoo
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 445-451, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52096
https://doi.org/10.1115/MNHT2008-52096
View Paper titled, Sessile Drop Evaporation on Surfaces of Various Wettability
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Topics: Evaporation
Proceedings Papers

Effect of CuO Nanoparticle Concentration on R134A/Lubricant Pool Boiling Heat Transfer

Mark A. Kedzierski
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 453-460, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52116
https://doi.org/10.1115/MNHT2008-52116
View Paper titled, Effect of CuO Nanoparticle Concentration on R134A/Lubricant Pool Boiling Heat Transfer
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Topics: Heat transfer, Lubricants, Nanoparticles, Pool boiling, Boiling, Nanofluids, Particulate matter, Refrigerants, Copper