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Proceedings Papers

Thermal Behavior in a Multi-Layer Metal Thin-Film With Interfacial Contact Conductance by the Parabolic Two-Step Model

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Tsung-Wen Tsai, Yung-Ming Lee
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 461-466, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52168
https://doi.org/10.1115/MNHT2008-52168
View Paper titled, Thermal Behavior in a Multi-Layer Metal Thin-Film With Interfacial Contact Conductance by the Parabolic Two-Step Model
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Topics: Electrical conductance, Metals, Thin films, Heat, Microscale devices, Approximation, Electrons, Failure, Heating, Laplace transforms
Proceedings Papers

Phonon Thermal Boundary Conductance in 1-D Chains: Comparison Between the Semiclassical and Nonequilibrium Green’s Function Formalisms

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Patrick E. Hopkins, Pamela M. Norris, Mikiyas S. Tsegaye, Avik Ghosh
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 467-476, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52233
https://doi.org/10.1115/MNHT2008-52233
View Paper titled, Phonon Thermal Boundary Conductance in 1-D Chains: Comparison Between the Semiclassical and Nonequilibrium Green’s Function Formalisms
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Topics: Chain, Electrical conductance, Phonons, Energy transformation, Thermal equilibrium, Dimensions, Equilibrium (Physics), Nanoscale phenomena, Thermal conductivity, Transport theory
Proceedings Papers

Measurements of Thermal Conductivity of Thin Films by 3-Omega Method

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Saburo Tanaka, Makoto Takiishi, Koji Miyazaki, Hiroshi Tsukamoto
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 477-483, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52260
https://doi.org/10.1115/MNHT2008-52260
View Paper titled, Measurements of Thermal Conductivity of Thin Films by 3-Omega Method
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Topics: Thermal conductivity, Thin films
Proceedings Papers

A Molecular Dynamics Study on Effects of Nanostructural Clearances at an Interface on Thermal Resistance

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Masahiko Shibahara, Kosuke Inoue, Kiyomori Kobayashi
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 485-491, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52276
https://doi.org/10.1115/MNHT2008-52276
View Paper titled, A Molecular Dynamics Study on Effects of Nanostructural Clearances at an Interface on Thermal Resistance
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Topics: Molecular dynamics, Thermal resistance, Nanoscale phenomena, Temperature, Density, Temperature gradient, Atoms, Heat flux, Simulation
Proceedings Papers

Effects of High Current Density at Nanoscale Point Contacts

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Hsinyi Lo, James A. Bain
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 493-502, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52349
https://doi.org/10.1115/MNHT2008-52349
View Paper titled, Effects of High Current Density at Nanoscale Point Contacts
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Topics: Atomic force microscopy, Current density, Electrodiffusion, Nanoscale phenomena, Probes, Melting, Coating processes, Coatings, Contact resistance, Damage
Proceedings Papers

The Influence of Molecular Orientation on the Ability of Water to Enter a Carbon Nanotube at Different Temperatures

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James Cannon, Natalie Moore, Ortwin Hess
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 503-507, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52378
https://doi.org/10.1115/MNHT2008-52378
View Paper titled, The Influence of Molecular Orientation on the Ability of Water to Enter a Carbon Nanotube at Different Temperatures
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Topics: Carbon nanotubes, Temperature, Water, Flow (Dynamics), Nanotubes, Density, Density functional theory, Dynamics (Mechanics), Nanofluidics, Nanoscale phenomena
Proceedings Papers

Finite Element Modeling of Multi-Scale Thermal Contact Resistance

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M. K. Thompson
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 509-517, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52385
https://doi.org/10.1115/MNHT2008-52385
View Paper titled, Finite Element Modeling of Multi-Scale Thermal Contact Resistance
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Topics: Contact resistance, Finite element analysis, Modeling, Surface roughness
Proceedings Papers

The Enhancement of Marangoni Condensation Heat Transfer by Addition of Additives

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Baohong Peng, Li Yang
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 421-427, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52024
https://doi.org/10.1115/MNHT2008-52024
View Paper titled, The Enhancement of Marangoni Condensation Heat Transfer by Addition of Additives
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Topics: Condensation, Heat transfer
Proceedings Papers

Coupling Effect of Interfacial Transport on Particle-Surface Capillary Forces

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Bo Gao, Xiaofeng Peng
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 429-434, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52033
https://doi.org/10.1115/MNHT2008-52033
View Paper titled, Coupling Effect of Interfacial Transport on Particle-Surface Capillary Forces
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Topics: Particulate matter, Adhesion, Bridges (Structures), Evaporation, Heat, Theoretical analysis
Proceedings Papers

Temperature Dependence of Thermal Conductivity for Silicon Dioxide

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Da-Jeng Yao, Wei-Chih Lai, Heng-Chieh Chien
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 435-439, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52052
https://doi.org/10.1115/MNHT2008-52052
View Paper titled, Temperature Dependence of Thermal Conductivity for Silicon Dioxide
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Topics: Silicon, Temperature effects, Thermal conductivity
Proceedings Papers

Evaluation of Thermal Rectification at the Interface of Double-Layered Nanofilm by Molecular Dynamics Simulations

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Juekuan Yang, Zhenghua Liu, Yujuan Wang, Yunfei Chen
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 441-444, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52092
https://doi.org/10.1115/MNHT2008-52092
View Paper titled, Evaluation of Thermal Rectification at the Interface of Double-Layered Nanofilm by Molecular Dynamics Simulations
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Topics: Interfacial thermal resistance, Molecular dynamics simulation, Thermal rectification
Proceedings Papers

Sessile Drop Evaporation on Surfaces of Various Wettability

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Hyunsoo Song, Yongku Lee, Songwan Jin, Ho-Young Kim, Jung Yul Yoo
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 445-451, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52096
https://doi.org/10.1115/MNHT2008-52096
View Paper titled, Sessile Drop Evaporation on Surfaces of Various Wettability
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Topics: Evaporation
Proceedings Papers

Effect of CuO Nanoparticle Concentration on R134A/Lubricant Pool Boiling Heat Transfer

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Mark A. Kedzierski
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 453-460, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52116
https://doi.org/10.1115/MNHT2008-52116
View Paper titled, Effect of CuO Nanoparticle Concentration on R134A/Lubricant Pool Boiling Heat Transfer
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Topics: Heat transfer, Lubricants, Nanoparticles, Pool boiling, Boiling, Nanofluids, Particulate matter, Refrigerants, Copper