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Proceedings Papers

Fabrication of Phase Reflection Sawtooth Gratings Optimized by Scalar and Vector Way by Using Diamond Cutting

ChaBum Lee, T. Kuriyagawa, TaeJun Kim, SunKyu Lee
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 703-704, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70266
https://doi.org/10.1115/MicroNano2008-70266
View Paper titled, Fabrication of Phase Reflection Sawtooth Gratings Optimized by Scalar and Vector Way by Using Diamond Cutting
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Topics: Cutting, Diamonds, Diffraction gratings, Manufacturing, Reflection, Scalars, Diffraction, Polarization (Electricity), Polarization (Light), Polarization (Waves)
Proceedings Papers

Fabrication of Superhydrophilic Surfaces by Aluminum-Induced Crystallization of Amorphous Silicon

Kenneth Kollias, Hengyu Wang, Min Zou
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 631-633, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70143
https://doi.org/10.1115/MicroNano2008-70143
View Paper titled, Fabrication of Superhydrophilic Surfaces by Aluminum-Induced Crystallization of Amorphous Silicon
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Topics: Aluminum, Crystallization, Manufacturing, Silicon, Water
Proceedings Papers

Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems

Gyoko Nagayama, Ryuji Ando, Kei Muramatsu, Takaharu Tsuruta
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 725-726, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70323
https://doi.org/10.1115/MicroNano2008-70323
View Paper titled, Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems
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Topics: Etching, Manufacturing, Micro fuel cells, Microelectromechanical systems, Porosity, Silicon
Proceedings Papers

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Yuxin Sun, Masumi Saka
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 589-592, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70073
https://doi.org/10.1115/MicroNano2008-70073
View Paper titled, Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration
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Topics: Electrodiffusion, Manufacturing, Fibers, Aluminum, Anodes, Atoms, Crystallization, Current density, Temperature
Proceedings Papers

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

Zhibo Ma, Sen Ren, Dayong Qiao, Weizheng Yuan
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 593-596, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70079
https://doi.org/10.1115/MicroNano2008-70079
View Paper titled, Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer
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Topics: Manufacturing, Pressure sensors, Resonance, Semiconductor wafers, Silicon-on-insulator, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure, Silicon, Chemical etching
Proceedings Papers

Dynamics Evolution of Shock Waves in Laser-Material Interaction

Sobieslaw Gacek, Xinwei Wang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 667-675, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70181
https://doi.org/10.1115/MicroNano2008-70181
View Paper titled, Dynamics Evolution of Shock Waves in Laser-Material Interaction
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Topics: Dynamics (Mechanics), Laser materials, Shock waves, Absorption, Density, Engineering simulation, Lasers, Molecular dynamics, Plumes (Fluid dynamics), Pressure
Proceedings Papers

Failure Investigation and Analysis of Abnormal Capacitance of Accelerometer After ICP Release

Ping An, Yandong He, Shitao Wang, Yanping Bai, Yilong Hao
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 677-681, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70201
https://doi.org/10.1115/MicroNano2008-70201
View Paper titled, Failure Investigation and Analysis of Abnormal Capacitance of Accelerometer After ICP Release
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Topics: Accelerometers, Capacitance, Failure, Contamination, Epoxy resins, Etching, Failure analysis, Inspection, Plasmas (Ionized gases), Polishing
Proceedings Papers

Evaluation and Characterization of Titanium to Glass Anodic Bonding

Qiong Shu, Juan Su, Gang Zhao, Ying Wang, Jing Chen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 597-600, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70111
https://doi.org/10.1115/MicroNano2008-70111
View Paper titled, Evaluation and Characterization of Titanium to Glass Anodic Bonding
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Topics: Bonding, Glass, Semiconductor wafers, Titanium
Proceedings Papers

Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices

Yinhua Lei, Wei Wang, Huaiqiang Yu, Ting Li, Yufeng Jin, Haixia Zhang, Zhihong Li
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 601-604, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70112
https://doi.org/10.1115/MicroNano2008-70112
View Paper titled, Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices
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Topics: Micromachining, Etching, Silicon, Microelectromechanical systems
Proceedings Papers

The Effect of Duration of First and Second Anodization Steps on the Ordering of Nanopores in Anodic Aluminum Oxide Templates Achieved by Three Step Anodic Oxidation Process

M. Abdollahzadeh, N. Parvaini-Ahmadi, F. Nasirpouri
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 683-687, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70224
https://doi.org/10.1115/MicroNano2008-70224
View Paper titled, The Effect of Duration of First and Second Anodization Steps on the Ordering of Nanopores in Anodic Aluminum Oxide Templates Achieved by Three Step Anodic Oxidation Process
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Topics: Aluminum, Nanopores, Oxidation
Proceedings Papers

Study on Precision Positioning System of Two-Dimensional Platform Based on High-Speed and Large-Range

Chuan Yang, Zhi Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 689-696, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70255
https://doi.org/10.1115/MicroNano2008-70255
View Paper titled, Study on Precision Positioning System of Two-Dimensional Platform Based on High-Speed and Large-Range
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Topics: Artificial neural networks, Control algorithms, Control systems, Design, Errors, Fuzzy logic, Fuzzy reasoning, Machining, Stress
Proceedings Papers

Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching

Gang Zhao, Qiong Shu, Yue Li, Jing Chen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 605-608, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70125
https://doi.org/10.1115/MicroNano2008-70125
View Paper titled, Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching
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Topics: Plasma etching, Titanium, Etching, Plasmas (Ionized gases), Springs, Surface roughness
Proceedings Papers

A Combined Model and Its Verification for Femtosecond-Pulse Materials Interactions

Lan Jiang, Hai-Lung Tsai
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 609-614, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70127
https://doi.org/10.1115/MicroNano2008-70127
View Paper titled, A Combined Model and Its Verification for Femtosecond-Pulse Materials Interactions
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Topics: Damage, Equilibrium (Physics), Heat, Laser materials, Metals, Modeling, Nanoscale phenomena, Plasmas (Ionized gases), Shapes, Temperature
Proceedings Papers

Fabrication of Multilayer Tubular Nanoporous Ceramic Membranes via Gel-Casting Followed by Dip-Coating

P. Ahmadian Namini, A. A. Babaluo, M. Akhfash Ardestani, E. Jannatduost, M. Peyravi
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 697-702, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70256
https://doi.org/10.1115/MicroNano2008-70256
View Paper titled, Fabrication of Multilayer Tubular Nanoporous Ceramic Membranes via Gel-Casting Followed by Dip-Coating
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Topics: Casting, Ceramics, Coating processes, Coatings, Manufacturing, Membranes
Proceedings Papers

Fabrication of Nanoscale Vias by Offset Patterning

Chi Ho Lau, S. W. Ricky Lee
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 615-618, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70131
https://doi.org/10.1115/MicroNano2008-70131
View Paper titled, Fabrication of Nanoscale Vias by Offset Patterning
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Topics: Manufacturing, Nanoscale phenomena, Photolithography, Size reduction (Materials)
Proceedings Papers

Investigation on the Effects of Copper Electroplating Process

Yue Chen, Xiuhan Li, Shi Qing Chen, Haixia Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 619-622, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70132
https://doi.org/10.1115/MicroNano2008-70132
View Paper titled, Investigation on the Effects of Copper Electroplating Process
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Topics: Copper, Current density, Electrical resistivity, Electroplating
Proceedings Papers

Wafer Bonding Processes for the Manufacture of Microsystems

Tony Rogers, Nick Aitken
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 705-710, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70292
https://doi.org/10.1115/MicroNano2008-70292
View Paper titled, Wafer Bonding Processes for the Manufacture of Microsystems
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Topics: Bonding, Microelectromechanical systems, Semiconductor wafers, Bond strength, Glass, Manufacturing, Packaging, Temperature, Vacuum, Acoustics
Proceedings Papers

Fabrication of SiC MEMS Pressure Sensor Based on Novel Vacuum-Sealed Method

Chao Wang, Xiaobao Geng, Haixia Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 623-626, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70136
https://doi.org/10.1115/MicroNano2008-70136
View Paper titled, Fabrication of SiC MEMS Pressure Sensor Based on Novel Vacuum-Sealed Method
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Topics: Manufacturing, Microelectromechanical systems, Pressure sensors, Vacuum, Plasma-enhanced chemical vapor deposition, Stiction, Mechanical properties, Micromachining, Sealing (Process), Semiconductor wafers
Proceedings Papers

Back-Side Wafer Grinding Quality Affecting Back-End Assembly Process for LCD Driver ICs

Mu-Chun Wang, Zhen-Ying Hsieh, Kuo-Shu Huang, Shuang-Yuan Chen, Heng-Sheng Huang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 557-561, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70014
https://doi.org/10.1115/MicroNano2008-70014
View Paper titled, Back-Side Wafer Grinding Quality Affecting Back-End Assembly Process for LCD Driver ICs
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Topics: Grinding, Manufacturing, Semiconductor wafers, Assembly lines, Crystals, Data collection, Diluents, Reliability, Semiconductors (Materials), Shapes
Proceedings Papers

An Integrated Approach to High-Speed Probe-Based Nanofabrication: SPM Imaging

Yan Yan, Qingze Zou
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 711-720, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70297
https://doi.org/10.1115/MicroNano2008-70297
View Paper titled, An Integrated Approach to High-Speed Probe-Based Nanofabrication: SPM Imaging
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Topics: Imaging, Nanofabrication, Probes, Scanning probe microscopy, Atomic force microscopy, Actuators, Calibration, Control algorithms, Design, Dynamics (Mechanics)