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Proceedings Papers

Monitoring Technology for Achieving Intelligent Grinding System

Ichiro Inasaki
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 75-81, November 16–21, 1997
Paper No: IMECE1997-1078
DOI: https://doi.org/10.1115/IMECE1997-1078
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Topics: Grinding, Sensors, Wheels, Acoustic emissions, Monitoring systems, Abrasives, Artificial intelligence, Databases, Genetic algorithms, Reliability
Proceedings Papers

Online Estimation of Surface Roughness by Recurrent Fuzzy Inference in Grinding Process

Futoshi Kobayashi, Fumihito Arai, Toshio Fukuda, Makoto Onoda, Norimasa Marui
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 49-54, November 16–21, 1997
Paper No: IMECE1997-1074
DOI: https://doi.org/10.1115/IMECE1997-1074
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Topics: Grinding, Surface roughness, Manufacturing systems, Sensors, Shapes
Proceedings Papers

Discharge Quality Estimation and Significant Feature Identification in Micro-Electrical Discharge Machining

R. Ramabhadran, R. R. Hebbar, R. L. Kashyap, S. Chandrasekar
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 317-325, November 16–21, 1997
Paper No: IMECE1997-1106
DOI: https://doi.org/10.1115/IMECE1997-1106
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Topics: Electrical discharge machining, Machining, Sensors, Trains
Proceedings Papers

Open Architecture Modular Tool Kit for Motion and Machining Process Control

N. A. Erol, Y. Altintas
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 15-22, November 16–21, 1997
Paper No: IMECE1997-1070
DOI: https://doi.org/10.1115/IMECE1997-1070
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Topics: Computer numerical control machine tools, Machining, Process control, Robots, Computers, Lumber, Machine tools, Computer software, Control systems, Sensors
Proceedings Papers

Intelligent Process Monitoring for Rough Milling Operations Based on Digital Drive Currents and Machine Integrated Sensors

Michael Kaever, Manfred Weck
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 97-104, November 16–21, 1997
Paper No: IMECE1997-1081
DOI: https://doi.org/10.1115/IMECE1997-1081
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Topics: Currents, Machinery, Milling, Process monitoring, Sensors, Surface roughness
Proceedings Papers

Autonomous Calibration of Hexapod Machine Tools

Hanqi Zhuang, Lixin Liu, Oren Masory
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 443-449, November 16–21, 1997
Paper No: IMECE1997-1183
DOI: https://doi.org/10.1115/IMECE1997-1183
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Topics: Calibration, Machine tools, Machinery, Errors, Atlantic Ocean, Computer numerical control machine tools, Control equipment, Filters, Sensors
Proceedings Papers

Active Structural Control of Vertical Turning Lathe Vibrations

John E. Miesner, Reza Ghanadan, Stephen D. O’Regan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 105-112, November 16–21, 1997
Paper No: IMECE1997-1082
DOI: https://doi.org/10.1115/IMECE1997-1082
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Topics: Turning, Vibration, Control equipment, Signals, Accelerometers, Actuators, Capacitors, Chatter, Control systems, Electronic components
Proceedings Papers

A New Electromagnetic Contact Sensing Technique for Enhancing Machining Accuracy

V. A. Ostafiev, Patri K. Venuvinod
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 113-119, November 16–21, 1997
Paper No: IMECE1997-1083
DOI: https://doi.org/10.1115/IMECE1997-1083
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Topics: Accuracy and precision, Coatings, Coordinate measuring machines, Cutting, Cutting tools, Design, Fluids, Geometry, Inspection, Machinery
Proceedings Papers

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Hiro Ohzeki, Akihiro Mashine, Hideki Aoyama, Ichiro Inasaki
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 129-136, November 16–21, 1997
Paper No: IMECE1997-1085
DOI: https://doi.org/10.1115/IMECE1997-1085
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Topics: Milling, Process monitoring, Sensors, Torque, Cutting, Alloys, Failure, Fracture (Materials), Fracture (Process), Permeability
Proceedings Papers

Application Specific Calibration of AE Sensors for Machining Monitoring

W. Hundt, C. Scheer
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 63-68, November 16–21, 1997
Paper No: IMECE1997-1076
DOI: https://doi.org/10.1115/IMECE1997-1076
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Topics: Calibration, Machining, Sensors, Signals, Acoustic emissions, Transfer functions
Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997
Paper No: IMECE1997-1108
DOI: https://doi.org/10.1115/IMECE1997-1108
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Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption
Proceedings Papers

Prediction of Thermal Deformation of Machine Tool With Strain Sensor

Toshimichi Moriwaki, Eiji Shamoto, Masahiro Kawano
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 137-142, November 16–21, 1997
Paper No: IMECE1997-1086
DOI: https://doi.org/10.1115/IMECE1997-1086
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Topics: Machine tools, Strain sensors, Thermal deformation, Sensors, Deformation, Displacement, Machining centers, Strain gages, Strain measurement, Temperature distribution
Proceedings Papers

An Entropy-Based Index Evaluation Scheme for Multiple Sensor Fusion in Classification Process

Yubao Chen, Elsayed Orady
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 3-8, November 16–21, 1997
Paper No: IMECE1997-1068
DOI: https://doi.org/10.1115/IMECE1997-1068
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Topics: Entropy, Sensors, Decision making, Complex systems, Design, Feature extraction, Signals
Proceedings Papers

A Multi-Purpose Laser Sensor for Cutting Tools

Oleg Ryabov, Kazuo Mori, Nagayoshi Kasashima
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 9-14, November 16–21, 1997
Paper No: IMECE1997-1069
DOI: https://doi.org/10.1115/IMECE1997-1069
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Topics: Cutting tools, Lasers, Sensors, Milling, Displacement, Geometry, Chatter, Engineering prototypes, Failure, Laser beams
Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997
Paper No: IMECE1997-1223
DOI: https://doi.org/10.1115/IMECE1997-1223
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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation
Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997
Paper No: IMECE1997-1222
DOI: https://doi.org/10.1115/IMECE1997-1222
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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress
Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997
Paper No: IMECE1997-1224
DOI: https://doi.org/10.1115/IMECE1997-1224
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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers
Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997
Paper No: IMECE1997-1220
DOI: https://doi.org/10.1115/IMECE1997-1220
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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors
Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997
Paper No: IMECE1997-1228
DOI: https://doi.org/10.1115/IMECE1997-1228
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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature
Proceedings Papers

Investigation of Boundary Layer Behavior on Single and Tandem Cylinders

T. Lee, A. Panagakos
Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 103-112, November 16–21, 1997
Paper No: IMECE1997-0048
DOI: https://doi.org/10.1115/IMECE1997-0048
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Topics: Boundary layers, Cylinders, Sensors, Circular cylinders, Flow (Dynamics), Flow separation, Pressure measurement, Temperature, Unsteady flow, Vortex shedding