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Proceedings Papers

In Situ Thermal Measurement of Polymers

Carson Powers, Simon Bratescu, Peter Bearden, Fahim Dorsey, Jessica Trinh, Dal Hyung Kim, Jungkyu Park
Proc. ASME. IMECE2024, Volume 9: Heat Transfer and Thermal Engineering, V009T11A012, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145513
https://doi.org/10.1115/IMECE2024-145513
View Paper titled, In Situ Thermal Measurement of Polymers
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Topics: Polymers, Thermal conductivity, Elastomers, Polymer chains, Fillers (Materials), Flexible electronics, Phonons, Deformation, Electromagnetic scattering, Mechanical testing
Proceedings Papers

Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations

Simon Bratescu, Jungkyu Park
Proc. ASME. IMECE2023, Volume 7: Energy, V007T08A086, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112656
https://doi.org/10.1115/IMECE2023-112656
View Paper titled, Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations
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Topics: Algorithms, Density, Fuels, Heat flux, Molecular dynamics, Molecular dynamics simulation, Molten salt reactors, Phonons, Simulation, Temperature
Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1340
https://doi.org/10.1115/IMECE1996-1340
View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
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Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering
Proceedings Papers

Heat Transport in the Perpendicular Direction of Superlattices and Periodic Thin-Film Structures

G. Chen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 13-24, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1331
https://doi.org/10.1115/IMECE1996-1331
View Paper titled, Heat Transport in the Perpendicular Direction of Superlattices and Periodic Thin-Film Structures
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Topics: Heat, Superlattices, Thin films, Interfacial thermal resistance, Boundary-value problems, Electromagnetic scattering, First law of thermodynamics, Heat transfer, Integral equations, Mean free path
Proceedings Papers

Application of Diffuse Mismatch Theory to the Prediction of Thermal Boundary Resistance in Thin-Film High-T c Superconductors

Patrick E. Phelan
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 99-105, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1342
https://doi.org/10.1115/IMECE1996-1342
View Paper titled, Application of Diffuse Mismatch Theory to the Prediction of Thermal Boundary Resistance in Thin-Film High-T c Superconductors
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Topics: Interfacial thermal resistance, Thin films, Temperature, Acoustics, Design, Electromagnetic scattering, High temperature, Phonons, Sensors, Switches
Proceedings Papers

Dynamics of Periodic Sandwich Beams

Eshagh Farzaneh Joubaneh, Jihong Ma
Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A107, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94730
https://doi.org/10.1115/IMECE2022-94730
View Paper titled, Dynamics of Periodic Sandwich Beams
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Topics: Absorption, Composite materials, Dynamics (Mechanics), Energy gap, Filters, Longitudinal waves, Metamaterials, Phonons, Sandwich structures, Vibration
Proceedings Papers

Phonon Boltzmann Transport Equation Based Simulation of Frequency Domain Thermoreflectance Experiments

Siddharth Saurav, Sandip Mazumder
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A062, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95630
https://doi.org/10.1115/IMECE2022-95630
View Paper titled, Phonon Boltzmann Transport Equation Based Simulation of Frequency Domain Thermoreflectance Experiments
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Topics: Phonons, Simulation, Thermoreflectance, Lasers, Pumps, Finite volume methods, Relaxation (Physics), Signals, Space, Temperature
Proceedings Papers

A Domain Specific Language Applied to Phonon Boltzmann Transport for Heat Conduction

Eric Heisler, Siddharth Saurav, Aadesh Deshmukh, Sandip Mazumder, Ponnuswamy Sadayappan, Hari Sundar
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A012, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95034
https://doi.org/10.1115/IMECE2022-95034
View Paper titled, A Domain Specific Language Applied to Phonon Boltzmann Transport for Heat Conduction
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Topics: Heat conduction, Phonons, Complex systems, Computer software, Heat transfer, Nanoscale phenomena, Numerical analysis, Optimization, Physics, Semiconductor devices
Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0956
https://doi.org/10.1115/IMECE1997-0956
View Paper titled, Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films
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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)
Proceedings Papers

Periodic Heat Flux-Temperature Phase Difference for Thin Metal Films

Kathy J. Hays-Stang, A. Haji-Sheikh
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 205-212, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0959
https://doi.org/10.1115/IMECE1997-0959
View Paper titled, Periodic Heat Flux-Temperature Phase Difference for Thin Metal Films
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Topics: Heat, Metals, Temperature, Electrons, Heat transfer, Phonons, Thin films, Heat capacity, Heat flux, Microscale heat transfer
Proceedings Papers

Depth of Thermal Penetration in the Fast Transient Process of Heat Transport

D. Y. Tzou, Kevin K. S. Chiu, Jorge E. Beraun, J. K. Chen
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 137-143, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0699
https://doi.org/10.1115/IMECE1998-0699
View Paper titled, Depth of Thermal Penetration in the Fast Transient Process of Heat Transport
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Topics: Heat, Transients (Dynamics), Relaxation (Physics), Diffusion (Physics), Temperature, Electromagnetic scattering, Electron-phonon interactions, Failure, Heat flux, Phonons
Proceedings Papers

Anisotropic Thermal Conductivity of Si/SiGe Superlattice

S. Q. Zhou, G. Chen, J. L. Liu, X. Y. Zheng, K. L. Wang
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 249-254, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0711
https://doi.org/10.1115/IMECE1998-0711
View Paper titled, Anisotropic Thermal Conductivity of Si/SiGe Superlattice
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Topics: Anisotropy, Superlattices, Thermal conductivity, Phonons, Electromagnetic scattering, Gallium arsenide, Heat conduction, Materials properties, Nanostructures , Radiation scattering
Proceedings Papers

Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity

Jennifer R. Lukes, Xin-Gang Liang, Chang-Lin Tien
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 229-240, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0709
https://doi.org/10.1115/IMECE1998-0709
View Paper titled, Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity
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Topics: Molecular dynamics, Thermal conductivity, Thin films, Film thickness, Microscale devices, Phonons, Temperature, Wave interference, Waves
Proceedings Papers

Molecular Dynamics Simulation of Thermal Conductivity in Bulk Silicon and Nanowires

Sebastian G. Volz, Gang Chen
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 199-208, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0706
https://doi.org/10.1115/IMECE1998-0706
View Paper titled, Molecular Dynamics Simulation of Thermal Conductivity in Bulk Silicon and Nanowires
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Topics: Molecular dynamics simulation, Nanowires, Silicon, Thermal conductivity, Phonons, Crystals, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Approximation
Proceedings Papers

Thermal Transport in Carbon Nanocomposites Under Mechanical Strain

Jungkyu Park, Nick Kinports, Jihad Kudsy
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A087, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70556
https://doi.org/10.1115/IMECE2021-70556
View Paper titled, Thermal Transport in Carbon Nanocomposites Under Mechanical Strain
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Topics: Carbon, Carbon nanotubes, Nanocomposites, Thermal conductivity, Composite materials, Polymer chains, Polymer composites, Deformation, Electromagnetic scattering, Flexible electronics
Proceedings Papers

Phonon Scattering From Carbon Nanotube and Graphene Junction Under Mechanical Deformation

Ian Durr, Matheus Prates, Jungkyu Park
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A086, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70349
https://doi.org/10.1115/IMECE2021-70349
View Paper titled, Phonon Scattering From Carbon Nanotube and Graphene Junction Under Mechanical Deformation
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Topics: Carbon nanotubes, Deformation, Electromagnetic scattering, Graphene, Junctions, Phonons, Radiation scattering, Scattering (Physics)
Proceedings Papers

Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage

William P. King, Juan G. Santiago, Thomas W. Kenny, Kenneth E. Goodson
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 583-588, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0324
https://doi.org/10.1115/IMECE1999-0324
View Paper titled, Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage
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Topics: Data storage systems, Heat transfer, Modeling, Thermomechanics, Polymers, Cantilevers, Temperature, Atomic force microscopy, Heat, Phonons
Proceedings Papers

Thermal Conductivity of Nano-Porous Bismuth Thin Films for Thermoelectric Applications

David W. Song, Wei-Ning Shen, Taofang Zeng, Weili Liu, Gang Chen, Bruce Dunn, Caroline D. Moore, Mark S. Goorsky, Tamara Radetic, Ronald Gronsky
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 345-349, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1003
https://doi.org/10.1115/IMECE1999-1003
View Paper titled, Thermal Conductivity of Nano-Porous Bismuth Thin Films for Thermoelectric Applications
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Topics: Thermal conductivity, Thin films, Temperature, Electrical conductivity, Electron transport, Metals, Phonons, Porosity, Porous materials
Proceedings Papers

Microscale Heat Conduction in Dielectric Thin Tubes

Long-Jye Sheu, Jenn-Der Lin, Fu-Chu Chou
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 123-130, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1070
https://doi.org/10.1115/IMECE1999-1070
View Paper titled, Microscale Heat Conduction in Dielectric Thin Tubes
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Topics: Heat conduction, Microscale devices, Heat flux, Phonons, Thermal conductivity, Annulus, Approximation, Heat, Radiative heat transfer, Size effect
Proceedings Papers

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Per G. Sverdrup, Y. Sungtaek Ju, Kenneth E. Goodson
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 41-49, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1061
https://doi.org/10.1115/IMECE1999-1061
View Paper titled, Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors
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Topics: Engineering simulation, Heat conduction, Silicon-on-insulator, Simulation, Transistors, Phonons, Silicon, Temperature, Thermal diffusion, Mean free path