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Keywords: Stencil design
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Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 705-712, July 8–12, 2007
Paper No: HT2007-32067
... of solder voids on the performance of thermal vias under QFN thermal pads. The model confirmed that the performance of thermal vias is not very sensitive to void area fraction. Solder voids QFN Thermal vias Stencil design Parametric studies Thermal Performance FEA 1 Copyright © 2007 by ASME...