1-1 of 1
Keywords: Solder voids
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 705-712, July 8–12, 2007
Paper No: HT2007-32067
... 07 04 2009 The objective of this study is to empirically investigate the dependence of solder voids and related interconnect defects in QFN packages, on such design variables as stencil aperture pattern and size, as well as quantity and location of thermal vias. A non-traditional...