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Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 705-712, July 8–12, 2007
Paper No: HT2007-32067
... of solder voids on the performance of thermal vias under QFN thermal pads. The model confirmed that the performance of thermal vias is not very sensitive to void area fraction. Solder voids QFN Thermal vias Stencil design Parametric studies Thermal Performance FEA 1 Copyright © 2007 by ASME...
Proc. ASME. HT-FED2004, Volume 1, 229-237, July 11–15, 2004
Paper No: HT-FED2004-56242
... Mexico 87545, USA Arsalan Razani Mechanical Engineering Department The University of New Mexico Albuquerque, New Mexico 87131, USA Keywords: metal foam, effective thermal conductivity, FEA, porous material ABSTRACT Geometric models are used to simplify the complex, three- dimensional geometry of metal...