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Proceedings Papers

Simulation of Time-Domain Thermo-Reflectance Experiments Using the Anisotropic Fourier Heat Conduction Equation and the Phonon Boltzmann Transport Equation

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Siddharth Saurav, Sandip Mazumder
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T04A002, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131125
https://doi.org/10.1115/HT2024-131125
View Paper titled, Simulation of Time-Domain Thermo-Reflectance Experiments Using the Anisotropic Fourier Heat Conduction Equation and the Phonon Boltzmann Transport Equation
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Topics: Anisotropy, Heat conduction, Phonons, Simulation, Thermoreflectance, Thermal conductivity, Lasers, Temperature, Aluminum, Polarization (Electricity)
Proceedings Papers

Thermal Conductivity Extraction From Frequency Domain Thermo-Reflectance Experiments Using the Phonon Boltzmann Transport Equation

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Siddharth Saurav, Sandip Mazumder
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T02A003, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-106992
https://doi.org/10.1115/HT2023-106992
View Paper titled, Thermal Conductivity Extraction From Frequency Domain Thermo-Reflectance Experiments Using the Phonon Boltzmann Transport Equation
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Topics: Phonons, Thermal conductivity, Thermoreflectance, Pumps, Relaxation (Physics), Fittings, Heat conduction, Lasers, Probes, Signals
Proceedings Papers

Development of a Numerical Model to Assess Sensitivity for Fiber Probe Frequency-Domain Thermoreflectance Measurements

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Ronald J. Warzoha
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T09A002, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-80540
https://doi.org/10.1115/HT2022-80540
View Paper titled, Development of a Numerical Model to Assess Sensitivity for Fiber Probe Frequency-Domain Thermoreflectance Measurements
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Topics: Computer simulation, Fibers, Probes, Thermoreflectance, Thermal properties, Cladding systems (Building), Microscopes, Thermal conductivity, Transducers
Proceedings Papers

Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments

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Siddharth Saurav, Sandip Mazumder
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T15A001, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-8920
https://doi.org/10.1115/HT2020-8920
View Paper titled, Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments
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Topics: Thermal conductivity, Thermoreflectance, Heat conduction, Boundary-value problems, Transducers, Cooling, Electrical conductance, Heat, Lasers, Pumps
Proceedings Papers

Thermal Conductivity Measurement of In 0.10 Ga 0.90 As 0.96 N 0.04 Thin Film

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Antony Jan, Ramez Cheaito, Kenneth E. Goodson, Bruce M. Clemens
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T15A007, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-5089
https://doi.org/10.1115/HT2017-5089
View Paper titled, Thermal Conductivity Measurement of In 0.10 Ga 0.90 As 0.96 N 0.04 Thin Film
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Topics: Thermal conductivity measurement, Thin films, Thermal conductivity, Electromagnetic scattering, Gallium arsenide, Metalorganic chemical vapor deposition, Optical fiber, Phonons, Radiation scattering, Scattering (Physics)
Proceedings Papers

Analytical Solutions of Enhanced Gray Boltzmann Transport Equation on Transient Thermal Grating and Time-Domain Thermoreflectance Experiments

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Dadong Wang, Zhengxian Qu, Yanbao Ma
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T13A003, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-5040
https://doi.org/10.1115/HT2017-5040
View Paper titled, Analytical Solutions of Enhanced Gray Boltzmann Transport Equation on Transient Thermal Grating and Time-Domain Thermoreflectance Experiments
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Topics: Diffraction gratings, Thermoreflectance, Transients (Dynamics), Heat, Fourier transforms, Nanoscale phenomena, Signals
Proceedings Papers

Temperature Measurement of Microscale Electronic Devices With 3D Thermoreflectance Imaging

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Hongjie Zhang, Sy-Bor Wen
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A003, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4954
https://doi.org/10.1115/HT2017-4954
View Paper titled, Temperature Measurement of Microscale Electronic Devices With 3D Thermoreflectance Imaging
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Topics: Imaging, Microscale devices, Temperature measurement, Thermoreflectance, Signals, Temperature distribution, Calibration, Construction, Field theories (Physics), High temperature
Proceedings Papers

Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness

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Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A001, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7043
https://doi.org/10.1115/HT2016-7043
View Paper titled, Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness
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Topics: Metrology, Resolution (Optics), Steady state, Flow (Dynamics), Heat, Interfacial thermal resistance, Junctions, Measurement systems, Measurement uncertainty, Performance characterization
Proceedings Papers

The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance

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Ramez Cheaito, John C. Duda, Thomas E. Beechem, Jon F. Ihlefeld, Khalid Hattar, Edward S. Piekos, Amit Misra, Jon K. Baldwin, Patrick E. Hopkins
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A009, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17541
https://doi.org/10.1115/HT2013-17541
View Paper titled, The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance
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Topics: Copper, Electrical conductance, Electron transport, Electromagnetic scattering, Electrons, Metals, Thermal conductivity, Resistors, Temperature, Thermoreflectance
Proceedings Papers

Thermal Conductivity Measurement of Cobalt-Iron Thin Films Using the Time-Resolved Thermoreflectance Technique

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Taehee Jeong, Jian-Gang Zhu
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 235-240, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88330
https://doi.org/10.1115/HT2009-88330
View Paper titled, Thermal Conductivity Measurement of Cobalt-Iron Thin Films Using the Time-Resolved Thermoreflectance Technique
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Topics: Cobalt, Iron, Thermal conductivity, Thermal conductivity measurement, Thermoreflectance, Thin films
Proceedings Papers

Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques

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Patrick E. Hopkins, Justin R. Serrano, Leslie M. Phinney
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 497-503, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88269
https://doi.org/10.1115/HT2009-88269
View Paper titled, Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques
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Topics: Electrical conductance, Probes, Pumps, Thermal conductivity, Thermoreflectance, Locks (Waterways), Signals, Top-tensioned risers, Heating, Thin films
Proceedings Papers

Experimental Measurement of Multiple Thermal Properties by Error Minimization

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Brian Smith, Cristina Amon
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 283-291, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32190
https://doi.org/10.1115/HT2007-32190
View Paper titled, Experimental Measurement of Multiple Thermal Properties by Error Minimization
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Topics: Errors, Fittings, Temperature measurement, Thermal properties, Thermoreflectance, Thin films, Polymer films, Actuators, Algorithms, Approximation
Proceedings Papers

Thermal Conductivity Measurements and Modeling of Phase-Change GST Materials

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Yizhang Yang, Taehee Jeong, Hendrik F. Hamann, Jimmy Zhu, Mehdi Asheghi
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 925-932, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32830
https://doi.org/10.1115/HT2007-32830
View Paper titled, Thermal Conductivity Measurements and Modeling of Phase-Change GST Materials
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Topics: Modeling, Thermal conductivity, Cycles, Data storage systems, Density, Disks, Electrical resistance, Jitter, Optimization, Phase change materials
Proceedings Papers

Analysis and Mitigation of Sample Heating in Thermoreflectance Microscopy

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Andrew C. Miner, Uttam Ghoshal
Proc. ASME. HT2005, Heat Transfer: Volume 4, 891-894, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72849
https://doi.org/10.1115/HT2005-72849
View Paper titled, Analysis and Mitigation of Sample Heating in Thermoreflectance Microscopy
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Topics: Heating, Microscopy, Thermoreflectance, Heat flux, Temperature, Electronic systems, Errors, MEMS packaging, Nanoelectromechanical systems, Pacific Rim
Proceedings Papers

Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications

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Y. Yang, Chun-Teh Li, S. M. Sadeghipour, M. Asheghi, H. Dieker, M. Wuttig
Proc. ASME. HT2005, Heat Transfer: Volume 4, 837-843, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72679
https://doi.org/10.1115/HT2005-72679
View Paper titled, Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications
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Topics: Phase change materials, Thermal characterization, Metals, Electronic systems, Interfacial thermal resistance, MEMS packaging, Modeling, Nanoelectromechanical systems, Pacific Rim, Thermoreflectance