We here present the results of an effort to determine the influence of the parameters affecting cold-plate performance and to minimize the total thermal resistance of a CPU cold-plate. An analysis based on analytical calculations and CFD simulations shows that spreading resistance is affected not only by the heat source area, cold-plate thickness and thermal conductivity of the cold-plate material, but also by the effective heat transfer coefficient of the interface between cold-plate and cooling liquid. Different options for optimizing heat transfer through the cold-plate are discussed.
- Heat Transfer Division
Optimal Design of Coldplates for CPU Coolers
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Rasmussen, CN, & Terp, CB. "Optimal Design of Coldplates for CPU Coolers." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 739-745. ASME. https://doi.org/10.1115/HT2007-32376
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